Three Phase Rectifier Bridge in ECO-PAC 2

Features • Package with DCB ceramic base plate • Isolation voltage 3000 V~ • Planar passivated chips • Blocking voltage up to 1600 V • Low forward voltage drop • Leads suitable for PC board soldering Applications • Supplies for DC power equipment • Input rectifiers for PWM inverter • Bat

文件：36.47 Kbytes 页数：1 Pages

IXYS

艾赛斯

T-1 3/4 PACKAGE SOLID STATE LAMP

Description The MVL-564B, a blue source color device, is made with InGaN ( on SiC substrate) LED die. The package is T-1 3/4( 5mm) water clear plastic lens package. Features High performance - 2.5mW (470nm) Superior SiC substrate technology Excellent chip to chip consistency Hi

文件：44.83 Kbytes 页数：2 Pages

UOT

东贝光电

T-1 3/4 ( f 5mm) PACKAGE SOLID STATE LAMP PRELIMINARY

Description The MVL-564SG, a green source color device, is made with InGaN ( on SiC substrate) LED die. The package is T-1 3/4 (ф5mm) water clear plastic Features • High performance - 2.0mW (505nm) • Superior SiC substrate technology • Excellent chip to chip consistency • High reliability A

文件：45.42 Kbytes 页数：2 Pages

UOT

东贝光电

T-1 3/4 ( f 5mm) PACKAGE SOLID STATE LAMP

Description The MVL-564TG, a green source color device, is made with InGaN ( on SiC substrate) LED die. The package is T-1 3/4 (ф 5mm) water clear plastic type. Features • High performance - 1.5mW (525nm) • Superior SiC substrate technology • Excellent chip to chip consistency • High reliabi

文件：33.29 Kbytes 页数：2 Pages

UOT

东贝光电