This square package with just 2mm outline combines best performance with a small footprint.

Features: Package: white SMT package, colored diffused silicone resin Chip technology: InGaN on Sapphire Typ. Radiation: 120° (Lambertian emitter) Color: Cx = 0.57, Cy = 0.42 acc. to CIE 1931 (● converted yellow) ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

文件：1.39569 Mbytes 页数：22 Pages

OSRAM

艾迈斯欧司朗

This square package with just 2mm outline combines best performance with a small footprint.

Features: Package: white SMT package, colored diffused silicone resin Chip technology: InGaN on Sapphire Typ. Radiation: 120° (Lambertian emitter) Color: Cx = 0.57, Cy = 0.42 acc. to CIE 1931 (● converted yellow) ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) 

文件：1.39536 Mbytes 页数：22 Pages

AMSCO

艾迈斯欧司朗

OSRAM SYNIOS® S2222, KY DDLM31.FY

这款产品采用方形封装结构，厚度仅为 2mm，将优异性能与小巧结构完美融于一身。中心布置的芯片可轻松将光线耦合到光学系统中。不同的颜色和白光选择可为各种应用带来极高的灵活性。

ams-OSRAM

艾迈斯欧司朗