ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES

DESCRIPTION Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high per

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Microsemi

美高森美

ENHANCED PERFORMANCE SURFACE MOUNT EPSM?줙yperabrupt Varactor Diodes TM

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Microsemi

美高森美

Varactors (Surface Mount)

Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high performance wirele

Microchip

微芯科技

Package：模具；包装：托盘 类别：分立半导体产品 二极管 - 可变电容（变容器，可变电抗器） 描述：SI TVAR NON HERMETIC EPSM SMT

Microchip

微芯科技

Package：模具；包装：散装 类别：分立半导体产品 二极管 - 可变电容（变容器，可变电抗器） 描述：SI TVAR NON HERMETIC EPSM SMT

Microchip

微芯科技

Package：2-SMD，无引线；包装：卷带（TR） 类别：分立半导体产品 二极管 - 可变电容（变容器，可变电抗器） 描述：SI TVAR NON HERMETIC EPSM SMT

Microchip

微芯科技