Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

Features - Package: white molded SMD ceramic package - Chip technology: UX:3 - Typ. Radiation: 120° (Lambertian emitter) - Color: λdom = 525 nm (● true green) - Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification for Aut

文件：1.90204 Mbytes 页数：24 Pages

OSRAM

艾迈斯欧司朗

OSRAM OSRAM OSTAR® Projection Compact, KT CSLNM1.13

结构紧凑的光源设计，热点分离的焊盘设计能够提高散热性能，高电流芯片技术可以提高光学输出。

ams-OSRAM

艾迈斯欧司朗

Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

Features - Package: white molded SMD ceramic package - Chip technology: UX:3 - Typ. Radiation: 120° (Lambertian emitter) - Color: λdom = 525 nm (● true green) - Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification for Aut

文件：1.90204 Mbytes 页数：24 Pages

OSRAM

艾迈斯欧司朗

Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

Features - Package: white molded SMD ceramic package - Chip technology: UX:3 - Color: λdom = 530 nm (● true green) - Corrosion Robustness Class: 3B - ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) 

文件：1.80441 Mbytes 页数：23 Pages

OSRAM

艾迈斯欧司朗