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K4T1G164QQ-HCLF7中文资料三星数据手册PDF规格书

K4T1G164QQ-HCLF7
厂商型号

K4T1G164QQ-HCLF7

功能描述

1Gb Q-die DDR2 SDRAM Specification

文件大小

886.4 Kbytes

页面数量

44

生产厂商 Samsung semiconductor
企业简称

SAMSUNG三星

中文名称

三星半导体官网

原厂标识
SAMSUNG
数据手册

下载地址一下载地址二到原厂下载

更新时间

2025-8-4 9:31:00

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K4T1G164QQ-HCLF7规格书详情

The 1Gb DDR2 SDRAM is organized as a 32Mbit x 4 I/Os x 8banks, 16Mbit x 8 I/Os x 8banks or 8Mbit x 16 I/Os x 8 banks device. This synchronous device achieves high speed double data-rate transfer rates of up to 800Mb/sec/pin (DDR2-800) for general applications.

Key Features

• JEDEC standard 1.8V ± 0.1V Power Supply

• VDDQ = 1.8V ± 0.1V

• 333MHz fCK for 667Mb/sec/pin, 400MHz fCK for 800Mb/sec/pin

• 8 Banks

• Posted CAS

• Programmable CAS Latency: 3, 4, 5, 6

• Programmable Additive Latency: 0, 1, 2, 3, 4, 5

• Write Latency(WL) = Read Latency(RL) -1

• Burst Length: 4 , 8(Interleave/nibble sequential)

• Programmable Sequential / Interleave Burst Mode

• Bi-directional Differential Data-Strobe (Single-ended data strobe is an optional feature)

• Off-Chip Driver(OCD) Impedance Adjustment

• On Die Termination

• Special Function Support

- PASR(Partial Array Self Refresh)

- 50ohm ODT

- High Temperature Self-Refresh rate enable

• Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95 °C

• All of Lead-free products are compliant for RoHS

产品属性

  • 型号:

    K4T1G164QQ-HCLF7

  • 制造商:

    SAMSUNG

  • 制造商全称:

    Samsung semiconductor

  • 功能描述:

    1Gb Q-die DDR2 SDRAM Specification

供应商 型号 品牌 批号 封装 库存 备注 价格
SAMSUNG
2022+
FBGA
20000
只做原装进口现货.假一罚十
询价
SAMSUNG/三星
23+
FBGA84
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
询价
SAMSUNG
BGA
68500
一级代理 原装正品假一罚十价格优势长期供货
询价
SAMSUNG
23+
TSSOP
65480
询价
SAM
BGA
1200
正品原装--自家现货-实单可谈
询价
SAMSUNG
21+
BGA
12588
原装正品,自己库存 假一罚十
询价
SAMSUNG/三星
24+
BGA
20000
只做正品原装现货
询价
SAMSUNG
13+
TSOP
8
询价
SAMSUNG
23+
TSSOP
9562
询价
SAMSUNG
23+
BGA
50000
全新原装正品现货,支持订货
询价