Power FET (Ceramic Package Type)

GENERAL DESCRIPTION The KGF1322, housed in a ceramic package with integrated heat sink, is a discrete UHF-band power FET that features high efficiency, high output power, and low current operation. The KGF1322 specifications are guaranteed to a fixed matching circuit for 5.8 V and 850 MHz; exte

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Power FET (Ceramic Package Type)

GENERAL DESCRIPTION\nThe KGF1322, housed in a ceramic package with integrated heat sink, is a discrete UHF-band power FET that features high efficiency, high output power, and low current operation. The KGF1322 specifications are guaranteed to a fixed matching circuit for 5.8 V and 850 MHz; external • High output power: 33 dBm (min.)\n• Low thermal resistance: 12°C/W (typ.)\n• Package: 3PHTP ;

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RS232/EIA562/RS485 Transceivers

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凌力尔特

RS232/EIA562/RS485 Transceivers

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凌力尔特

Low Resistance Plastic Packaged PIN Diodes

Description The SMP1322 series of plastic packaged, surface mountable PIN diodes are designed for high volume switch applications from 10 MHz to beyond 2 GHz.The ultra low resistance of these diodes (1.5 Ω maximum at 1 mA and 0.5 Ω typical at 10 mA) make the SMP1322 series particularly suited t

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