PNP SWITCHING SILICON TRANSISTOR

PNP SWITCHING SILICON TRANSISTOR Qualified per MIL-PRF-19500/396

文件：70.11 Kbytes 页数：2 Pages

Microsemi

美高森美

PNP Silicon Switching -40V to -60V, -1.5A

This specification covers the performance requirements for PNP silicon switching 2N3762, 2N3763, 2N3764 and 2N3765 transistors. Four levels of product assurance (JAN, JANTX, JANTXV and JANS) are provided for each encapsulated device type as specified in MIL-PRF-19500/396 and two levels of product as The device packages for the encapsulated device types are as follows: (2N3762L and 2N3763L) (TO-5), (2N3762 and 2N3763) (TO-39), 2N3764 and 2N3765 (TO-46) , surface mount (U4) and (UA). \nThe dimensions and topography for JANHC and JANKC unencapsulated die are as outlined in MIL-PRF-19500/396.;

Microchip

微芯科技

Package：TO-205AD，TO-39-3 金属罐；包装：剪切带（CT）带盒（TB） 类别：分立半导体产品 晶体管 - 双极性晶体管（BJT）- 单个 描述：TRANS PNP 40V 1.5A TO39

Microchip

微芯科技

PNP SWITCHING SILICON TRANSISTOR

PNP SWITCHING SILICON TRANSISTOR Qualified per MIL-PRF-19500/396

文件：70.11 Kbytes 页数：2 Pages

Microsemi

美高森美

PNP Silicon Switching -40V to -60V, -1.5A

This specification covers the performance requirements for PNP silicon switching 2N3762, 2N3763, 2N3764 and 2N3765 transistors. Four levels of product assurance (JAN, JANTX, JANTXV and JANS) are provided for each encapsulated device type as specified in MIL-PRF-19500/396 and two levels of product as The device packages for the encapsulated device types are as follows: (2N3762L and 2N3763L) (TO-5), (2N3762 and 2N3763) (TO-39), 2N3764 and 2N3765 (TO-46) , surface mount (U4) and (UA). \nThe dimensions and topography for JANHC and JANKC unencapsulated die are as outlined in MIL-PRF-19500/396.;

Microchip

微芯科技

PNP Silicon Switching -40V to -60V, -1.5A

This specification covers the performance requirements for PNP silicon switching 2N3762, 2N3763, 2N3764 and 2N3765 transistors. Four levels of product assurance (JAN, JANTX, JANTXV and JANS) are provided for each encapsulated device type as specified in MIL-PRF-19500/396 and two levels of product as The device packages for the encapsulated device types are as follows: (2N3762L and 2N3763L) (TO-5), (2N3762 and 2N3763) (TO-39), 2N3764 and 2N3765 (TO-46) , surface mount (U4) and (UA). \nThe dimensions and topography for JANHC and JANKC unencapsulated die are as outlined in MIL-PRF-19500/396.;

Microchip

微芯科技

Package：TO-205AA，TO-5-3 金属罐；包装：散装 类别：分立半导体产品 晶体管 - 双极性晶体管（BJT）- 单个 描述：TRANS PNP 40V 1.5A TO5

Microchip

微芯科技