J-SERIES SIPM ARRAY数据手册ONSEMI中文资料规格书

描述 Description

High Fill-Factor Arrays of J-Series SiPM Sensors:
ON Semiconductor's J-Series silicon photomultiplier (SiPM) sensors have been used to create high fill-factor, scalable arrays. The TSV-packaged sensors are mounted onto PCB boards with minimal dead space. The ArrayJ products are available in a variety of formats and formed of either 3 mm, 4 mm or 6 mm pixels. The back of each ArrayJ has either one or more multi-way connectors or a BGA (ball grid array) that allow access to each pixels standard output, and in some cases, the fast output as well.

特性 Features

• High fill-factor, scalable arrays
• Variety of formats ranging from 2×2 to 8×8
• Minimal deadspace, with fill factors of >90%
• Each array as either a multi-way connector or BGA on the reverse for access to all signals
• The pixel signals can either be read out individually for imaging applications, or summed by the user to create a large area, single-channel sensor
• The pixel-level performance is exactly as per that of the individual J-Series sensors
• Optional evaluation boards are available for easy access to signals

应用 Application

• Medical Imaging
• Hazard & Threat
• 3D Ranging & Sensing
• Biophotonics & Sciences
• High Energy Physics