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IST1-04

包装:散装 类别:连接器,互连器件 矩形连接器外壳 描述:CONN PLUG HSG 4POS 1.00MM

SamtecSamtec Inc.

申泰

BL1-04

1ABRIDGERECTIFIERS

FRONTIER

Frontier Electronics

CBRLD1-04

SURFACEMOUNTLOWPROFILESILICONBRIDGERECTIFIER1AMP,200THRU1000VOLTS

CentralCentral Semiconductor Corp

美国中央半导体

CBRLD1-04

SURFACEMOUNTLOWPROFILESILICONBRIDGERECTIFIER

CentralCentral Semiconductor Corp

美国中央半导体

CMMR1-04

SURFACEMOUNTSILICONGENERALPURPOSERECTIFIERS

CentralCentral Semiconductor Corp

美国中央半导体

CMMR1-04

SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1AMP,200THRU1000VOLTS

CentralCentral Semiconductor Corp

美国中央半导体

CMMR1-04

SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1.0AMP,200THRU1000VOLTS

CentralCentral Semiconductor Corp

美国中央半导体

CMR1-04

SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER

CentralCentral Semiconductor Corp

美国中央半导体

CMR1-04

SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1AMP,200THRU1000VOLTS

CentralCentral Semiconductor Corp

美国中央半导体

CMR1-04

GENERALPURPOSERECTIFIER1.0AMP,200THRU1,000VOLTS

DESCRIPTION: TheCENTRALSEMICONDUCTOR1.0AmpSurfaceMountSiliconRectifierisahighquality,wellconstructed,highlyreliablecomponentdesignedforuseinalltypesofcommercial,industrial,entertainment,computer,andautomotiveapplications.Toorderdeviceson12mmTapeandReel(3000

CentralCentral Semiconductor Corp

美国中央半导体

CMR1-04M

GENERALPURPOSERECTIFIER1.0AMP,200THRU1,000VOLTS

DESCRIPTION: TheCENTRALSEMICONDUCTORCMR1-02Mseries1.0Ampsurfacemountsiliconrectifierisawellconstructed,highlyreliablecomponentdesignedforuseinalltypesofcommercial,industrial,entertainment,computer,andautomotiveapplicationswheresmallsizeisrequired.TheSMAcas

CentralCentral Semiconductor Corp

美国中央半导体

CMR1-04M

SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1AMP

CentralCentral Semiconductor Corp

美国中央半导体

CMR1-04M

SURFACEMOUNTSILICONGENERALPURPOSERECTIFIERS

CentralCentral Semiconductor Corp

美国中央半导体

CXR1-04

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CXR1-04

SURFACEMOUNTGENERALPURPOSERECTIFIER

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CXR1-04C

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CZR1-04

SURFACEMOUNTHIGHVOLTAGERECTIFIER

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CZR1-04

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CZR1-04C

SURFACEMOUNTHIGHVOLTAGERECTIFIER

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CZR1-04C

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

产品属性

  • 产品编号:

    IST1-04

  • 制造商:

    Samtec Inc.

  • 类别:

    连接器,互连器件 > 矩形连接器外壳

  • 系列:

    Micro Mate™ IST1

  • 包装:

    散装

  • 连接器类型:

    插头

  • 触头类型:

    公形引脚

  • 针位数:

    4

  • 间距:

    0.039"(1.00mm)

  • 安装类型:

    自由悬挂

  • 触头端接:

    压接

  • 紧固类型:

    锁存器支座

  • 颜色:

    绿色

  • 描述:

    CONN PLUG HSG 4POS 1.00MM

供应商型号品牌批号封装库存备注价格
SAMTEC
23+
强势砷泰
6800
砷泰专家/可订期货
询价
23+
N/A
65700
一级代理放心采购
询价
XPPOWER
24+25+/26+27+
车规-电源模块
3280
一一有问必回一特殊渠道一有长期订货一备货HK仓库
询价
XP-POWER
21+
SMD-5
5636
厂家代理原装正品现货特价供应DC-DC电源模
询价
NIPPONSEISENCABLE
22+
DIP
50000
只做原装正品,假一罚十,欢迎咨询
询价
NIPPONSEISENCABLE
22+
DIP
54990
郑重承诺只做原装进口货
询价
NIPPONSEISENCABLE
23+
DIP
89630
当天发货全新原装现货
询价
IMD
22+
TSSOP
2650
原装优势!绝对公司现货
询价
IMD
2023+
TSSOP
3827
全新原厂原装产品、公司现货销售
询价
HIDEEP
QFN
10265
提供BOM表配单只做原装货值得信赖
询价
更多IST1-04供应商 更新时间2024-6-18 9:10:00