ISO6540中文资料德州仪器数据手册PDF规格书

1 Features

• Up to 50Mbps data rate

• Robust SiO2 isolation barrier

• Functional Isolation (DBQ-16):

– 400VRMS , 566VDC working voltage

– 707VRMS , 1000VDC transient voltage (60s)

• Wide temperature range: –40°C to 125°C

• ±150kV/μs typical CMTI

• Supply range: 1.71V to 5.5V

• Default output high ( ISO654x ) and low

( ISO654xF ) options

• 1.5mA per channel typical at 1Mbps and 3.3V

(ISO6540)

• Low propagation delay: 11ns typical at 3.3V

• Robust electromagnetic compatibility (EMC)

– System-level ESD, EFT, and surge immunity

– Low emissions

• SSOP (DBQ-16) Package

2 Applications

• Power supplies

• Grid, electricity meter

• Motor drives

• Factory automation

• Building automation

• Lighting

• Appliances

3 Description

The ISO654x devices are general purpose functional

isolators for cost sensitive, space constrained

applications that require isolation for non-safety

applications. The isolation barrier supports a working

voltage of 400VRMS / 566VDC and transient over

voltages of 707VRMS / 1000VDC .

The ISO654x devices provide high EMC performance

while isolating CMOS or LVCMOS digital I/Os.

ISO654x uses SiO2 as the isolation barrier. Each

isolation channel has a logic input and output buffer

separated by the insulation barrier. These devices

come with enable pins that can be used to put the

respective outputs in high impedance.

The ISO6540 and ISO6540F devices have all

channels in the forward direction. The ISO6541

and ISO6541F devices have one reverse-direction

channel. The ISO6542 and ISO6542F devices have

two reverse-direction channels.

In the event of input power or signal loss, the default

output is high for devices without the suffix F and

low for devices with the suffix F. See Section 7.4 for

further details.

These devices help prevent noise currents on GPIOs

or data buses such as SPI, UART RS-485, RS-232,

and CAN from causing data corruption or damaging

sensitive circuitry. Through chip design and layout

techniques, the electromagnetic compatibility of the

devices have been significantly enhanced to ease

system-level design.