ISL3282EMRTEP-TK中文资料瑞萨数据手册PDF规格书

特性 Features

• Specifications per DSCC VID V62/10601-01XB

• Full military temperature electrical performance from

-55°C to +125°C

• Controlled baseline with one wafer fabrication site and one

assembly/test site

• Full homogeneous lot processing in wafer fab

• No combination of wafer fabrication lots in assembly

• Full traceability through assembly and test by date/trace

code assignment

• Enhanced process change notification

• Enhanced obsolescence management

• Eliminates need for up-screening a COTS component

• ±16.5kV IEC61000 ESD protection on RS-485 inputs

• Class 3 ESD level on all other pins. . . . . . . . . . . . . .>5kV HBM

• Wide supply range . . . . . . . . . . . . . . . . . . . . . . . . . 3.0V to 5.5V

• Specified for +125°C operation

• Logic supply pin (VL) eases operation in mixed supply

systems

• Full fail-safe (open, short, terminated/undriven)

• True 1/8 unit load allows up to 256 devices on the bus

• High data rates. . . . . . . . . . . . . . . . . . . . . . . . . . up to 16Mbps

• Low quiescent supply current. . . . . . . . . . 500µA (maximum)

• Very low shutdown supply current . . . . . . . 20µA (maximum)

• -7V to +12V common-mode input voltage range

• Tri-statable Rx available (active low or high EN input)

• 5V tolerant logic inputs when VCC  5V