ISL21009CMB850EP中文资料瑞萨数据手册PDF规格书

Features

• Specifications per DSCC VID V62/08629

• Full Mil-Temp Electrical Performance from -55°C to +125°C

• Controlled Baseline with One Wafer Fabrication Site and

One Assembly/Test Site

• Full Homogeneous Lot Processing in Wafer Fab

• No Combination of Wafer Fabrication Lots in Assembly

• Full Traceability Through Assembly and Test by

Date/Trace Code Assignment

• Enhanced Process Change Notification

• Enhanced Obsolescence Management

• Eliminates Need for Up-Screening a COTS Component

• Output Voltages . . . . . . . . . . . . . . 2.500V, 4.096V, 5.000V

• Initial Accuracy . . . . . . . . . . . . . . . . . . . . .±0.5mV, ±1.0mV

• Input Voltage Range. . . . . . . . . . . . . . . . . . . 3.5V to 16.5V

• Output Voltage Noise . . . . . . . . .4.5μVP-P (0.1Hz to 10Hz)

• Supply Current . . . . . . . . . . . . . . . . . . . . . . . .180μA (Max)

• Temperature Coefficient . . . . . . . . . . . . 3ppm/°C, 5ppm/°C

• Output Current Capability. . . . . . . . . . . . . . . Up to ±7.0mA

• Operating Temperature Range. . . . . . . . .-55°C to +125°C

• Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Ld SOIC