128Kx8 LOW VOLTAGE, ULTRA LOW POWER CMOS STATIC RAM

FEATURES  High-speed access time: 45ns, 55ns  CMOS low power operation – Operating Current: 26mA (max) at 125°C – CMOS Standby Current: 3.0 uA (typ) at 25°C  TTL compatible interface levels  Single power supply –1.65V-2.2V VDD (IS62/65WV1288FALL) – 2.2V-3.6V VDD (IS62/65WV1288FBLL) 

文件：909.25 Kbytes 页数：17 Pages

ISSI

矽成半导体

128Kx8 LOW VOLTAGE, ULTRA LOW POWER CMOS STATIC RAM

FEATURES  High-speed access time: 45ns, 55ns  CMOS low power operation – Operating Current: 26mA (max) at 125°C – CMOS Standby Current: 3.0 uA (typ) at 25°C  TTL compatible interface levels  Single power supply –1.65V-2.2V VDD (IS62/65WV1288FALL) – 2.2V-3.6V VDD (IS62/65WV1288FBLL) 

文件：909.25 Kbytes 页数：17 Pages

ISSI

矽成半导体

128Kx8 LOW VOLTAGE, ULTRA LOW POWER CMOS STATIC RAM

FEATURES  High-speed access time: 45ns, 55ns  CMOS low power operation – Operating Current: 26mA (max) at 125°C – CMOS Standby Current: 3.0 uA (typ) at 25°C  TTL compatible interface levels  Single power supply –1.65V-2.2V VDD (IS62/65WV1288FALL) – 2.2V-3.6V VDD (IS62/65WV1288FBLL) 

文件：909.25 Kbytes 页数：17 Pages

ISSI

矽成半导体

128Kx8 LOW VOLTAGE, ULTRA LOW POWER CMOS STATIC RAM

FEATURES  High-speed access time: 45ns, 55ns  CMOS low power operation – Operating Current: 26mA (max) at 125°C – CMOS Standby Current: 3.0 uA (typ) at 25°C  TTL compatible interface levels  Single power supply –1.65V-2.2V VDD (IS62/65WV1288FALL) – 2.2V-3.6V VDD (IS62/65WV1288FBLL) 

文件：909.25 Kbytes 页数：17 Pages

ISSI

矽成半导体

Package：32-TFSOP（0.724"，18.40mm 宽）；包装：管件 类别：集成电路（IC） 存储器 描述：IC SRAM 1MBIT PARALLEL 32TSOP I

ISSI, Integrated Silicon Solution Inc

Package：32-TFSOP（0.724"，18.40mm 宽）；包装：管件 类别：集成电路（IC） 存储器 描述：IC SRAM 1MBIT PARALLEL 32TSOP I

ISSI, Integrated Silicon Solution Inc

Package：32-TFSOP（0.724"，18.40mm 宽）；包装：散装 类别：集成电路（IC） 存储器 描述：IC SRAM 1MBIT PARALLEL 32TSOP I

ISSI, Integrated Silicon Solution Inc