IS64VF25618C-6.5B3A3中文资料矽成半导体数据手册PDF规格书

FEATURES

 Internal self-timed write cycle

 Individual Byte Write Control and Global Write

 Clock controlled, registered address, data and

control

 Burst sequence control using MODE input

 Three chip enable option for simple depth expansion and address pipelining

 Common data inputs and data outputs

 Auto Power-down during deselect

 Single cycle deselect

 Snooze MODE for reduced-power standby

 JEDEC 100-pin QFP, 165-ball BGA and 119-ball BGA packages

 Power supply:

 LF: VDD 3.3V (± 5%), VDDQ 3.3V/2.5V (± 5%)

 VF: VDD 2.5V (± 5%), VDDQ 2.5V (± 5%)

 JTAG Boundary Scan for BGA packages

 Industrial and Automotive temperature support

 Lead-free available

 Error Detection and Error Correction