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IS61LF12836EC

128K x36/32 and 256K x18 4Mb, ECC, SYNCHRONOUS FLOW-THROUGH SRAM

FEATURES  Internal self-timed write cycle  Individual Byte Write Control and Global Write  Clock controlled, registered address, data and control  Burst sequence control using MODE input  Three chip enable option for simple depth expansion and address pipelining  Common data inputs an

文件:2.40485 Mbytes 页数:36 Pages

ISSI

矽成半导体

IS61LF12836EC-6.5B2

128K x36/32 and 256K x18 4Mb, ECC, SYNCHRONOUS FLOW-THROUGH SRAM

FEATURES  Internal self-timed write cycle  Individual Byte Write Control and Global Write  Clock controlled, registered address, data and control  Burst sequence control using MODE input  Three chip enable option for simple depth expansion and address pipelining  Common data inputs an

文件:2.40485 Mbytes 页数:36 Pages

ISSI

矽成半导体

IS61LF12836EC-6.5B2L

128K x36/32 and 256K x18 4Mb, ECC, SYNCHRONOUS FLOW-THROUGH SRAM

FEATURES  Internal self-timed write cycle  Individual Byte Write Control and Global Write  Clock controlled, registered address, data and control  Burst sequence control using MODE input  Three chip enable option for simple depth expansion and address pipelining  Common data inputs an

文件:2.40485 Mbytes 页数:36 Pages

ISSI

矽成半导体

IS61LF12836EC-6.5B3

128K x36/32 and 256K x18 4Mb, ECC, SYNCHRONOUS FLOW-THROUGH SRAM

FEATURES  Internal self-timed write cycle  Individual Byte Write Control and Global Write  Clock controlled, registered address, data and control  Burst sequence control using MODE input  Three chip enable option for simple depth expansion and address pipelining  Common data inputs an

文件:2.40485 Mbytes 页数:36 Pages

ISSI

矽成半导体

IS61LF12836EC-6.5B3L

128K x36/32 and 256K x18 4Mb, ECC, SYNCHRONOUS FLOW-THROUGH SRAM

FEATURES  Internal self-timed write cycle  Individual Byte Write Control and Global Write  Clock controlled, registered address, data and control  Burst sequence control using MODE input  Three chip enable option for simple depth expansion and address pipelining  Common data inputs an

文件:2.40485 Mbytes 页数:36 Pages

ISSI

矽成半导体

IS61LF12836EC-6.5TQL

128K x36/32 and 256K x18 4Mb, ECC, SYNCHRONOUS FLOW-THROUGH SRAM

FEATURES  Internal self-timed write cycle  Individual Byte Write Control and Global Write  Clock controlled, registered address, data and control  Burst sequence control using MODE input  Three chip enable option for simple depth expansion and address pipelining  Common data inputs an

文件:2.40485 Mbytes 页数:36 Pages

ISSI

矽成半导体

IS61LF12836EC-7.5B2

128K x36/32 and 256K x18 4Mb, ECC, SYNCHRONOUS FLOW-THROUGH SRAM

FEATURES  Internal self-timed write cycle  Individual Byte Write Control and Global Write  Clock controlled, registered address, data and control  Burst sequence control using MODE input  Three chip enable option for simple depth expansion and address pipelining  Common data inputs an

文件:2.40485 Mbytes 页数:36 Pages

ISSI

矽成半导体

IS61LF12836EC-7.5B2L

128K x36/32 and 256K x18 4Mb, ECC, SYNCHRONOUS FLOW-THROUGH SRAM

FEATURES  Internal self-timed write cycle  Individual Byte Write Control and Global Write  Clock controlled, registered address, data and control  Burst sequence control using MODE input  Three chip enable option for simple depth expansion and address pipelining  Common data inputs an

文件:2.40485 Mbytes 页数:36 Pages

ISSI

矽成半导体

IS61LF12836EC-7.5B3

128K x36/32 and 256K x18 4Mb, ECC, SYNCHRONOUS FLOW-THROUGH SRAM

FEATURES  Internal self-timed write cycle  Individual Byte Write Control and Global Write  Clock controlled, registered address, data and control  Burst sequence control using MODE input  Three chip enable option for simple depth expansion and address pipelining  Common data inputs an

文件:2.40485 Mbytes 页数:36 Pages

ISSI

矽成半导体

IS61LF12836EC-7.5B3L

128K x36/32 and 256K x18 4Mb, ECC, SYNCHRONOUS FLOW-THROUGH SRAM

FEATURES  Internal self-timed write cycle  Individual Byte Write Control and Global Write  Clock controlled, registered address, data and control  Burst sequence control using MODE input  Three chip enable option for simple depth expansion and address pipelining  Common data inputs an

文件:2.40485 Mbytes 页数:36 Pages

ISSI

矽成半导体

详细参数

  • 型号:

    IS61LF12836EC

  • 功能描述:

    静态随机存取存储器 4M, 3.3V, 6.5ns 128Kx36 Sync 静态随机存取存储器

  • RoHS:

  • 制造商:

    Cypress Semiconductor

  • 存储容量:

    16 Mbit

  • 组织:

    1 M x 16

  • 访问时间:

    55 ns

  • 电源电压-最大:

    3.6 V

  • 电源电压-最小:

    2.2 V

  • 最大工作电流:

    22 uA

  • 最大工作温度:

    + 85 C

  • 最小工作温度:

    - 40 C

  • 安装风格:

    SMD/SMT

  • 封装/箱体:

    TSOP-48

  • 封装:

    Tray

供应商型号品牌批号封装库存备注价格
ISSI, Integrated Silicon Solut
24+
100-LQFP(14x20)
56200
一级代理/放心采购
询价
ISSI
1931+
N/A
493
加我qq或微信,了解更多详细信息,体验一站式购物
询价
ISSI(美国芯成)
2447
LQFP-100(14x20)
315000
72个/托盘一级代理专营品牌!原装正品,优势现货,长
询价
ISSI
25+
QFP-100
932
就找我吧!--邀您体验愉快问购元件!
询价
ISSI(美国芯成)
2021+
LQFP-100(14x20)
499
询价
ISSI
22+
NA
493
加我QQ或微信咨询更多详细信息,
询价
ISSI Integrated Silicon Soluti
22+
100LQFP (14x20)
9000
原厂渠道,现货配单
询价
ISSI
23+
TQFP100
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
询价
ISSI
21+
TQFP100
900
一级代理,专注军工、汽车、医疗、工业、新能源、电力
询价
ISSI(美国芯成)
2022+原装正品
LQFP-100(14x20)
18000
支持工厂BOM表配单 公司只做原装正品货
询价
更多IS61LF12836EC供应商 更新时间2026-1-30 10:03:00