IS25WP01GJ中文资料矽成半导体数据手册PDF规格书

FEATURES

• Industry Standard Serial Interface

- IS25LP01GJ: 1Gbit/128Mbyte

- IS25WP01GJ: 1Gbit/128Mbyte

- 3 or 4 Byte Addressing Mode

- Supports Standard SPI, Fast, Dual, Dual

I/O, Quad, Quad I/O, SPI DTR, Dual I/O

DTR, Quad I/O DTR, and QPI

- Software & Hardware Reset

- Supports Serial Flash Discoverable

Parameters (SFDP)

- Dedicated WP# as an option(3)

• High Performance Serial Flash (SPI)

- 80MHz Normal Read

- Up to166Mhz Fast Read

- Up to 104MHz DTR (Dual Transfer Rate)

- Selectable Dummy Cycles

- Configurable Drive Strength

- Supports SPI Modes 0 and 3

- More than 100,000 Erase/Program Cycles

- More than 20-year Data Retention

• Flexible & Efficient Memory Architecture

- Chip Erase with Uniform Sector/Block

Erase (4/32/64KB or 4/32/256 KB)(2)

- Program 1 to 256 or 512 Byte per Page(2)

- Program/Erase Suspend & Resume

• Efficient Read and Program modes

- Continuous Read 8/16/32/64 Byte

Burst Wrap

- Selectable Burst Length

- QPI for Reduced Instruction Overhead

- Data Learning Pattern for training in DTR

operation

• Low Power with Wide Temp. Ranges

- Single Voltage Supply

IS25LP: 2.70V to 3.60V

IS25WP: 1.65V to 1.95V

- 16 mA Active Read Current

- 12 μA Standby Current

- 2 μA Deep Power Down

- Temp Grades:

Extended: -40°C to +105°C

Auto Grade (A3): -40°C to +125°C

• Advanced Security Protection

- Software and Hardware Write Protection

- Advanced Sector/Block Protection

- Top/Bottom Block Protection

- 4x1K Byte Dedicated Security Area

with OTP User-lockable Bits

- 128 bit Unique ID for Each Device

(Call Factory)

• Industry Standard Pin-out & Packages(1, 2)

- M =16-pin SOIC 300mil

- L = 8-contact WSON 8x6mm

- H = 24-ball TFBGA 6x8mm (5x5 ball array)

- Green Package (RoHS Compliant,

Halogen-Free) and TSCA Compliant