IS22EF04GP中文资料矽成半导体数据手册PDF规格书

FEATURES

• Packaged NAND flash memory with eMMC 5.1 interface

- IS21/22EF04GP: 4Gigabyte

- IS21/22EF08GP: 8Gigabyte

• Device is compliant with eMMC Specification Ver.4.3, 4.4, 4.41,4.5, 4.51, 5.0, 5.1

• Bus mode

- High-speed eMMC protocol

- Clock frequency: 0-200MHz.

- Ten-wire bus (clock, 1 bit command, 8 bit data bus) and a hardware reset.

• Supports three different data bus widths: 1-bit(default), 4 bits, 8 bits

- Data transfer rate: up to 52Mbyte/s (using 8 parallel data lines at 52 MHz)

- Single data rate: up to 200Mbyte/s @ 200MHz (HS200)

- Dual data rate: up to 400Mbyte/s @ 200MHz (HS400)

• Operating voltage range:

- VCCQ = 1.8 V/3.3 V

- VCC = 3.3 V

• Configured as pseudo-SLC (pSLC) mode for higher read/write performance, endurance, and reliability.

• Error free memory access

- Internal error correction code (ECC) to protect data communication

- Internal enhanced data management algorithm

- Solid protection from sudden power failure, safe-update operations for data content

• Security

- Support secure bad block erase and trim commands

- Enhanced write protection with permanent and partial protection options

• Major supported features

- HS400, Field Firmware Update (FFU), Power Off Notification, Pre EOL information, Enhanced Device

Life time, Optimal Size.

• Major supported eMMC 5.1 features

- Enhanced Strobe, Cache Flushing Report, BKOPS Control, Cache Barrier, RPMB Throughput Improve,

Secure Write Protection.

• CMD Queuing is not supported.

• Operating Temperature:

- Industrial Grade: -40 ℃ ~ 85 ℃

- Automotive Grade (A2): -40 ℃ ~ 105 ℃

• Storage Temperature: -40 ℃ ~ 105 ℃

• Package

- 153 FBGA (11.5mm x 13mm x 1.0mm)

- 100 FBGA (14.0mm x 18.0mm x 1.4mm)

- Green Package (RoHS Compliant, Halogen-Free) and TSCA Compliant