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IS21TF64G-BCLI中文资料北京矽成数据手册PDF规格书

IS21TF64G-BCLI
厂商型号

IS21TF64G-BCLI

功能描述

16GB/32GB/64GB/128GB eMMC With eMMC 5.1 Interface & TLC NAND

文件大小

834.7 Kbytes

页面数量

36

生产厂商 Integrated Silicon Solution Inc
企业简称

ISSI北京矽成

中文名称

北京矽成半导体有限公司官网

原厂标识
数据手册

下载地址一下载地址二

更新时间

2024-9-22 18:05:00

IS21TF64G-BCLI规格书详情

GENERAL DESCRIPTION

ISSI eMMC products follow the JEDEC eMMC 5.1 standard. It is ideal for embedded storage solutions for Industrial application and automotive application, which require high performance across a wide range of operating temperatures. eMMC encloses the TLC Mode NAND and eMMC controller inside as one JEDEC standard package, providing a standard interface to the host. The eMMC controller directly manages NAND flash, including ECC, wear-leveling, IOPS optimization and read sensing.

FEATURES

• Packaged NAND flash memory with eMMC 5.1 interface

- IS21/22TF16G: 16Gigabyte

- IS21/22TF32G: 32Gigabyte

- IS21/22TF64G: 64Gigabyte

- IS21/22TF128G: 128Gigabyte

• Compliant with eMMC Specification Ver.4.3, 4.4, 4.41,4.5, 4.51, 5.0, 5.1

• Device can be converted to eMMC 4.3, 4.41, 4.51, 5.0 via initializing

• Bus mode

- High-speed eMMC protocol

- Clock frequency: 0-200MHz.

- Ten-wire bus (clock, 1 bit command, 8 bit data bus) and a hardware reset.

• Supports three different data bus widths : 1 bit(default), 4 bits, 8 bits

- Data transfer rate: up to 52Mbyte/s (using 8 parallel data lines at 52 MHz)

- Single data rate : up to 200Mbyte/s @ 200MHz (HS200)

- Dual data rate : up to 400Mbyte/s @ 200MHz (HS400)

• Operating voltage range :

- VCCQ = 1.8 V/3.3 V (Automotive A2 Grade only supports 1.8V VCCQ)

- VCC = 2.7 – 3.6V

• Error free memory access

- Internal error correction code (ECC) to protect data communication

- Internal enhanced data management algorithm

- Solid protection from sudden power failure, safe-update operations for data content

• Security

- Support secure erase and trim commands

- Enhanced write protection with permanent and partial protection options

• Key Features :

- HS400, Field Firmware Update (FFU), Power Off Notification, Pre EOL information, Enhanced Device Life

time, Optimal Size

• eMMC 5.1 Features:

- Command Queuing, Enhanced Strobe, Cache Flushing Report, BKOPS Control, Cache Barrier, RPMB

Throughput Improve, Secure Write Protection.

• Temperature range

- Industrial Grade (I): -40 ℃ ~ 85 ℃

- Automotive Grade (A1): -40 ℃ ~ 85 ℃

- Automotive Grade (A2): -40 ℃ ~ 105 ℃ (The Surface Temperature of Tc cannot be over 115 ℃)

• Package

- 153 FBGA (11.5mm x 13mm x 1.0mm)

- 100 FBGA (14.0mm x 18.0mm x 1.4mm)

供应商 型号 品牌 批号 封装 库存 备注 价格
ISSI
2020+
DIP
16800
绝对原装进口现货,假一赔十,价格优势!?
询价
ISSI
22+23+
DIP16
18771
绝对原装正品全新进口深圳现货
询价
ISSI
DIP
68900
原包原标签100%进口原装常备现货!
询价
ISSI
22+
DIP-16
8000
原装正品支持实单
询价
ISSI
23+
DIP
15000
全新原装现货假一赔十
询价
ISSI
DIP16
300
询价
ISSI Integrated Silicon Soluti
23+/24+
153-VFBGA
8600
只供原装进口公司现货+可订货
询价
ISSI
23+
DIP28
5000
原装正品,假一罚十
询价
ISSI
23+
DIP
7000
询价
22+
32350
原装正品 假一罚十 公司现货
询价