THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

文件：319.39 Kbytes 页数：10 Pages

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

文件：319.39 Kbytes 页数：10 Pages

IRF

ADAPTER, F-F, PANEL, TNC

文件：54.66 Kbytes 页数：1 Pages

Winchester

温彻斯特

ADAPTER, F-F, PANEL, TNC

文件：54.66 Kbytes 页数：1 Pages

Winchester

温彻斯特

Power Module

FEATURES ·Pressure contact technology for high reliability ·Industial standard package ·Electrically insulated baseplate ·Advanced medium power technology ·Minimum Lot-to-Lot variations for robust device performance and reliable operation APPLICATIONS ·Typical Applications ·Line recitifie

文件：262.57 Kbytes 页数：2 Pages

ISC

无锡固电