IRKT26/06AS90资料datasheet下载库存现货-114ic电子网

型号	下载订购	功能描述	制造商上传企业	LOGO
IRKT26/06AS90	文件：146.94 Kbytes Page：8 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. Features ■ Hig 文件：146.94 Kbytes 页数：8 Pages	IRF	IRF
IRKT26/06AS90	文件：150.39 Kbytes Page：8 Pages	ADD-A-pakTM GEN V Power Modules Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. Features ■ Hig 文件：150.39 Kbytes 页数：8 Pages	IRF	IRF
IRKT26/06AS90	文件：157.8 Kbytes Page：8 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR 文件：157.8 Kbytes 页数：8 Pages	IRF	IRF
IRKT26/06AS90	文件：155.55 Kbytes Page：8 Pages	ADD-A-pak-TM GEN V Power Modules 文件：155.55 Kbytes 页数：8 Pages	IRF	IRF
IRKT26/06AS90	文件：300 bytes Page：1 Pages	ADD-A-pak-TM GEN V Power Modules	Infineon 英飞凌	Infineon

更多IRKT26/06AS90供应商更新时间2025-10-4 14:00:00