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IRKN91/04AS90中文资料PDF规格书
IRKN91/04AS90规格书详情
Mechanical Description
The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu baseplate allow an easier mounting on the majority of heatsink with increased tolerance of surface roughness and improve thermal spread.
Features
■ High Voltage
■ Industrial Standard Package
■ Thick Al metal die and double stick bonding
■ Thick copper baseplate
■ UL E78996 approved
■ 3500VRMS isolating voltage
Benefits
■ Up to 1600V
■ Full compatible TO-240AA
■ High Surge capability
■ Easy Mounting on heatsink
■ Al203 DBC insulator
■ Heatsink grounded