IRK.26中文资料IRF数据手册PDF规格书

Mechanical Description

The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device.

特性 Features

■ High Voltage

■ Industrial Standard Package

■ Thick Al metal die and double stick bonding

■ Thick copper baseplate

■ UL E78996 approved

■ 3500VRMS isolating voltage

Benefits

■ Up to 1600V

■ Full compatible TO-240AA

■ High Surge capability

■ Easy Mounting on heatsink

■ Al203 DBC insulator

■ Heatsink grounded