IRFP2410中文资料IRF数据手册PDF规格书

Description

Fourth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications.

The TO-247 package is preferred for commercial-industrial applications where higher power levels preclude the use of TO-220 devices. The TO-247 is similar but superior to the earlier TO-218 package because of its isolated mounting hole. It also provides greater creepage distance between pins to meet the requirements of most safety specifications.

● Advanced Process Technology

● Ultra Low On-Resistance

● Dynamic dv/dt Rating

● Repetitive Avalanche Rated

● 175°C Operating Temperature

● Fast Switching

● Ease of Paralleling