IRF6633TR1中文资料IRF数据手册PDF规格书

描述 Description

The IRF6633 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80.

• RoHs Compliant Containing No Lead and Bromide

• Low Profile (<0.7 mm)

• Dual Sided Cooling Compatible

• Ultra Low Package Inductance

• Optimized for High Frequency Switching

• Ideal for CPU Core DC-DC Converters

• Optimized for both Sync.FET and some Control FET application

• Low Conduction and Switching Losses

• Compatible with existing Surface Mount Techniques