IPDD60R190G7中文资料Double DPAK (DDPAK) Innovative top-side cooled SMD solution for high power applications数据手册Infineon规格书

描述 Description

Infineon Technologies introduces Double DPAK (DDPAK), the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom. The benefits of the already existing high voltage technology 600V CoolMOS™ G7 superjunction (SJ) MOSFET is combined with the innovative concept of top-side cooling, providing a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies.

特性 Features

• Gives best-in-class FOM RDS(on) x Eoss and RDS(on) x Qg
• Innovative top-side cooling concept
• Inbuilt 4th pin Kelvin source configuration and low parasitic source inductance
• TCOB capability of >> 2.000 cycles, MSL1 compliant and total Pb-free

优势:
• Enabling highest energy efficiency
• Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
• Reduced parasitic source inductance improves e iciency and ease-of-use
• Enables higher power density solutions
• Exceeding the highest quality standards

应用 Application

Telecom, Server, Solar, PC power and SMPS