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IMXRT1170CEC_V01中文资料恩智浦数据手册PDF规格书

IMXRT1170CEC_V01
厂商型号

IMXRT1170CEC_V01

功能描述

i.MX RT1170 Crossover Processors Data Sheet for Consumer Products

文件大小

3.04151 Mbytes

页面数量

135

生产厂商 NXP Semiconductors
企业简称

nxp恩智浦

中文名称

恩智浦半导体公司官网

原厂标识
数据手册

下载地址一下载地址二到原厂下载

更新时间

2025-5-19 18:43:00

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IMXRT1170CEC_V01规格书详情

1.1 Features

The i.MX RT1170 processors are based on Arm Cortex®-M7 Core™ Platform, which has the following

features:

• The Arm Cortex-M7 Core Platform:

— 32 KB L1 Instruction Cache and 32 KB L1 Data Cache

— Floating Point Unit (FPU) with single-precision and double-precision support of Armv7-M

Architecture FPv5

— Support the Arm®v7-M Thumb instruction set, defined in the Armv7-M architecture

— Integrated Memory Protection Unit (MPU), up to 16 individual protection regions

— Up to 512 KB I-TCM and D-TCM in total

— Frequency of 1 GHz with Forward Body Biasing (FBB)

— Frequency of the core, as per Table 11, Operating ranges, on page 28.

• The Arm Cortex®-M4 Core platform:

— Cortex-M4 processor with single-precision FPU defined by Armv7-M architecture FPv4-SP

— Integrated MPU with 8 individual protection regions

— 16 KB Instruction Cache, 16 KB Data Cache, and 256 KB TCM

— Frequency of 400 MHz without body biasing

The SoC-level memory system consists of the following additional components:

— Boot ROM (256 KB)

— On-chip RAM (2 MB in total)

– Configurable 512 KB RAM shared with M7 TCM

– 256 KB RAM shared with M4 TCM

– Dedicated 1.25 MB OCRAM

— Secure always-on RAM (4 KB)

• External memory interfaces:

— 8/16/32-bit SDRAM, up to SDRAM-133/SDRAM-166/SDRAM-200

— 8/16-bit SLC NAND FLASH

— SD/eMMC

— SPI NOR/NAND FLASH

— Parallel NOR FLASH with XIP support

— Single/Dual channel Quad SPI FLASH with XIP support

— Hyper RAM/FLASH

— OCT FLASH

— Synchronization mode for all devices

• Timers and PWMs:

— Six General Programmable Timer (GPT) modules

– 4-channel generic 32-bit resolution timer for each

– Each supports standard capture and compare operation

— Two Periodical Interrupt Timer (PIT) modules

– Four timers for each module

– Generic 32-bit resolution timer

– Periodical interrupt generation

— Four Quad Timer (QTimer) modules

– 4-channel generic 16-bit resolution timer for each

– Each supports standard capture and compare operation

– Quadrature decoder integrated

— Four FlexPWMs

– Up to 8 individual PWM channels for each

– 16-bit resolution PWM suitable for Motor Control applications

— Four Quadrature Decoders

— Four Watch Dog (WDOG) modules

Each i.MX RT1170 processor enables the following interfaces to external devices (some of them are

muxed and not available simultaneously):

• Display Interface:

— Parallel RGB LCD interface (eLCDIF)

– Support 8/16/24-bit interface

– Support up to WXGA resolution @60fps

– Support Index color with 256 entry x 24-bit color LUT

— Parallel RGB LCD Interface Version 2 (LCDIFv2)

– Enhanced based on LCDIF version

– Support up to 8 layers of alpha blending

— MIPI Display Serial Interface (MIPI DSI)

– PHY integrated

– 2 data lanes interface with up to 1.5 GHz bit rate clock

— Smart LCD Display with 8080 interface through SEMC

• Audio:

— SPDIF input and output

— Four Synchronous Audio Interface (SAI) modules supporting I2S, AC97, TDM, and

codec/DSP interfaces

— Medium Quality Sound (MQS) interface via GPIO pads

— PDM microphone interface with 4 pairs of inputs

— Asynchronous Sample Rate Converter (ASRC)

• Graphics engine:

— Generic 2D (PXP)

– BitBlit

– Flexible image composition options—alpha, chroma key

– Porter-duff blending

– Image rotation (90, 180, 270)

– Image resize

– Color space conversion

– Multiple pixel format support (RGB, YUV444, YUV422, YUV420, YUV400)

– Standard 2D-DMA operation

— Vector Graphics Processing

– Real-time hardware curve tessellation of lines, quadratic, and cubic Bezier curves

– 16x Line Anti-aliasing

– OpenVG 1.1 support

– Vector Drawing

• Camera Interface:

— Parallel Camera Sensor Interface (CSI)

– Support 24-bit, 16-bit, and 8-bit input

– Barcode binarization and histogram statistics

— MIPI Camera Serial Interface (MIPI CSI)

– PHY integrated

– 2 data lanes interface with up to 1.5 GHz bit rate clock

• Connectivity:

— Two USB 2.0 OTG controllers with integrated PHY interfaces

— Two Ultra Secure Digital Host Controller (uSDHC) interfaces

– eMMC 5.0 compliance with HS400 support up to 400 MB/sec

– SD/SDIO 3.0 compliance with 200 MHz SDR signaling to support up to 100 MB/sec

– Support for SDXC (extended capacity)

— One 10M/100M Ethernet controller with support for IEEE1588

— One Gigabit Ethernet controller with support for AVB

— One Gigabit Ethernet controller with Time Sensitive Networking (TSN) Capability

— Twelve universal asynchronous receiver/transmitter (UARTs) modules

— Six I2C modules

— Six SPI modules

— Three FlexCAN (with Flexible Data-rate supported) modules

— Two EMV SIM modules

• Analog:

— Two Analog-Digital-Converters (ADC), which supports both differential and single-end inputs

— One Digital-Analog-Converter (DAC)

— Four Analog Comparators (ACMP)

• GPIO and Pin Multiplexing:

— General-purpose input/output (GPIO) modules with interrupt capability

— Input/output multiplexing controller (IOMUXC) to provide centralized pad control

— Two FlexIO modules

— 8 x 8 keypad

The i.MX RT1170 processors integrate advanced power management unit and controllers:

• Full PMIC integration, including on-chip DCDC and LDOs

• Temperature sensor with programmable trim points

• Hardware power management controller (GPC)

The i.MX RT1170 processors support the following system debug:

• Arm CoreSight debug and trace architecture

• Trace Port Interface Unit (TPIU) to support off-chip real-time trace

• Cross Triggering Interface (CTI)

• Support for 5-pin (JTAG) and SWD debug interfaces

Security functions are enabled and accelerated by the following hardware:

• High Assurance Boot (HAB)

• Cryptographic Acceleration and Assurance (CAAM) module:

— Public Key Cryptography Engine (PKHA)

— Symmetric Engines

— Cryptographic Hash Engine

— Random Number Generation (RNG4)

— Four Job Rings for use by processors

— Secure Hardware-Only Cryptographic Key Management

— Encrypted Boot

— Revision control check based on fuse values

— DEK includes IV

— Side channel attack countermeasures

— 64 KB secure RAM

• Inline Encryption Engine (IEE):

— External memory encryption/decryption

— I/O direct encrypted storage and retrieval (Stream Support)

— FlexSPI decryption only

• On-the-Fly AES Decryption (OTFAD):

— AES-128 Counter Mode On-the-Fly Decryption

— Hardware support for unwrapping “key blobs”

— Functionally acts as a slave sub-module to the FlexSPI

• Secure Non-Volatile Storage (SNVS):

— Secure real-time clock (SRTC)

— Zero Master Key (ZMK)

• Secure always-on RAM (4 KB)

• Secure key management and protection

— Physical Unclonable Function (PUF)

— UnDocumented Function (UDF)

— Built-in Manufacturing Protection Hardware

• Secure and trusted access control

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