IM73A135数据手册音频设备产品的麦克风规格书PDF

描述 Description

Infineon’s XENSIV™ MEMS analog microphone IM73A135 sets a new performance benchmark in MEMS microphones. A best-in-class signal to noise ratio (SNR) of 73 dB and a high acoustic overload point of 135 dBSPL enable clear audio pick up of the quietest and the loudest sounds. This microphone is based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. The IM73A135 allows designers to reach a level of high audio performance that was previously only achievable by ECMs while at the same time reaping the benefits inherent in MEMS technology.

特性 Features

• Ultra-low self-noise / ultra-high SNR (73 dB)
• Selectable power modes for battery critical applications (170/70 µA)
• Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
• Ultra high dynamic range and very high acoustic overload point (AOP) of 135 dBSPL
• Very tight part-to-part phase and sensitivity matching (± 1 dB)
• Flat frequency response with a very low LFRO (low frequency roll-off) of 20Hz
• Ultra-low group delay (2µs @ 1kHz)

应用 Application

• ANC Headphones
• Conference systems
• Smart speaker
• Surveillance
• Cameras

简介

IM73A135属于音频设备产品的麦克风。由制造生产的IM73A135麦克风麦克风是将声音转换成电信号以便存储、传输和/或转播的换能器。范围从大型悬臂式麦克风到常用的小型 MEMS 产品，并且可根据阻抗、额定电压、灵敏度、频率范围、端口位置、整体尺寸和安装类型进行区分。输出接口提供模拟、I2S、PDM 和 TDM 等种类。