IM70A135V01中文资料英飞凌数据手册PDF规格书

特性 Features

• Ultra-low 170μA current consumption in high performance mode

• Low current consumption 70μA in low power mode

• Signal-to-noise ratio of 70dB(A) SNR

• Acoustic overload point at 135dBSPL

• Flat frequency response with a low-frequency roll-off at 37 Hz

• Package dimensions: 3.50mm x 2.65mm x 1.00mm

Potential applications

• Active Noise Cancellation (ANC) headphones and wireless earbuds (TWS)

• Devices with Voice User Interface (VUI)

- Smart speakers

- Home automation

- IoT devices

• High quality audio capturing

- Conference systems

- Cameras and camcorders

• Industrial or home monitoring with audio pattern detection

描述 Description

Infineon’s XENSIV™ MEMS analog differential microphone IM70A135V01 is a compact size and high-performance microphone with a very high acoustic overload point of 135 dBSPL. This microphone is based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. The small size makes this microphone especially suited for TWS earbud applications.