IAUCN08S7N045T数据手册Infineon中文资料规格书

特性 Features

• Direct cooling path to ECU housing
• Virtually no heat flows into PCB
• Industry’s largest exposed pad area
• Freedom to route traces under package
• Can mount parts on back side of PCB
• Excellent on-resistance, RDS(on)
• Fast switching times (turn on/off)
• Tight threshold voltage, VGS(th), range
• Extended qualification beyond AEC-Q101
• Enhanced electrical testing
• Package is listed with JEDEC

优势:
• Enables excellent thermal management
• Thermal impedance improved 20% to 50%
• Thermal resistance improved 20% to 50%
• Helps reduce ECU volume or PCB area
• Helps reduce PCB cost (area, Cu, vias)
• Reduces PCB and system design effort
• Helps achieve highest power density
• Reduces conduction losses
• Superior switching performance
• Well-suited for parallel placement
• Quality and robustness for automotive
• Potential for second source supplier