HV53011中文资料16-Ch. ±135V Push-Pull Driver (+RTZ, CS)数据手册Microchip规格书

描述 Description

HV53011 is a high-voltage driver solution for surface haptic applications. It consists of 16 push-pull drivers capable of +/-135V output swing with Return-To-Zero (RTZ) function. Each output driver is capable of sourcing and sinking at least 24 mA. Each high-voltage output is capable of driving up to 250 pF capacitive load. A global current sensor function is also integrated into this device to monitor the charge and discharge currents. The measured current is mapped to a low voltage analog output with a scale factor of 3.1 V/V via a current sensing resistor.An SPI interface is used to communicate between the microcontroller/processor and the high voltage drivers. This interface accepts 3.3V logic I/O signals up to clock speeds of 32 MHz. Five digital LATCH control signals manage the data flow and the firing pattern. It establishes the output to one of four possible states: VPP, VNN, 0V or high impedance. A proper power on and off sequence is critical to ensure the operation of the high voltage driver. This driver requires four high voltage power rails, VPP, VPF, VNN, VNF, and three low voltage power rails, VCC, VSS and VLL. A companion integrated driver IC, HV53001, has a built-in power on/off sequence control circuits to maintain the proper orders.A shutdown function is available to disable the driver and set it to consume minimum power when the driver.The HV53011 device is packaged in a 8 x 8 mm 59-ball TFBGA package. All high voltage I/O are assigned to have sufficient clearance for safety purpose.Microchip has partnered with Tanvas to create this chipset that optimizes size and features for enabling surface haptic applications. Learn more >>

特性 Features

16-Channel Push-Pull Output w/Return-To-Zero (RTZ) and High Impedance (Hi-Z) Functions
Up to ±135V Output Voltage w/24 mA Minimum Source Sink Output Current (250pF Cload Max)
Current Sensor Output
SPI Interface with Quad-Latched (2-Bit/Channel) Architecture
Power-On Reset Function
Shutdown Function
59-Ball 8 x 8 mm TFBGA Package

简介

HV53011属于集成电路（IC）的移位寄存器。由制造生产的HV53011移位寄存器移位寄存器是低级逻辑器件，通常用于在串行和并行方式之间转换数字逻辑信号形式的数据，或在数字字内移动数据位的位置。移位寄存器通常使用集成到一个设备中的一组触发器来实现，常用于集成度更高的逻辑器件，但仍可用于 I/O 扩展等应用，在这些应用中离散形式的函数可能会非常有用。