Carrier-grade Edge Server Chassis for Open RAN / MEC

Features • Carrier-grade, full redundancy and extreme high performance • 3rd Generation Intel® Xeon® Scalable Processor with AI Acceleration • Support 5x 1U compute sleds or 2x 2U+1U compute sleds • Support 2x 1U switch sleds for redundancy • Support OCP NIC 3.0 Modules, 2U sled Support FH3/4

文件：3.14534 Mbytes 页数：2 Pages

LANNER

立端科技

HITAG core module hardware

文件：112.2 Kbytes 页数：24 Pages

PHI

飞利浦

HITAG core module hardware

文件：112.2 Kbytes 页数：24 Pages

PHI

飞利浦

HITAG core module hardware

文件：112.2 Kbytes 页数：24 Pages

PHI

飞利浦