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HT1MOA3S30/E/1中文资料PDF规格书
HT1MOA3S30/E/1规格书详情
Definitions
Objective of the Specifications
This specification lists the parameters to be fulfilled by the HITAG 1 chip module HT1 MOA3 S30 for contactless smart cards or similar transponders (as e.g. discs).
Definition of the Chip Module
A chip module is an electronically packaged chip covered with a globe top cap. The HT1 MOA3 S30 is above all used as card module, i.e. for further lamination into contactless smart cards according to ISO 10536.1.
So the HITAG 1 chip module HT1 MOA3 S30 is best suited for customers that do not want to spend time with micro assembly and therefore start - e.g. ISO card production - with the HITAG 1 chip module.
Use of the Modules
The HITAG 1 modules are designed to be connected to a coil and then to be further processed by packaging into a transponder (e.g. lamination into an ISO smart card). Specific processing information for the coil-module connection and packaging is given in the specification.
For production of contactless chip cards it is recommended to prepunch card foils to create a recess for the chip module in the card body.
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
PHI |
QFP |
68900 |
原包原标签100%进口原装常备现货! |
询价 | |||
PHI |
21+ |
QFP |
1000 |
优势代理渠道,原装正品,可全系列订货开增值税票 |
询价 | ||
NXP(恩智浦) |
23+ |
PLLMC |
6000 |
诚信服务,绝对原装原盘 |
询价 | ||
ZETEX |
2023+ |
SOT-23 |
80000 |
一级代理/分销渠道价格优势 十年芯程一路只做原装正品 |
询价 | ||
SOT-23 |
23+ |
NA |
15659 |
振宏微专业只做正品,假一罚百! |
询价 | ||
PHILIPS/飞利浦 |
23+ |
NA/ |
4250 |
原装现货,当天可交货,原型号开票 |
询价 | ||
NXP(恩智浦) |
23+ |
PLLMC |
7350 |
现货供应,当天可交货!免费送样,原厂技术支持!!! |
询价 | ||
BZD |
22+ |
QFP |
300 |
原装现货假一赔十 |
询价 | ||
PHI |
22+23+ |
QFP |
70857 |
绝对原装正品现货,全新深圳原装进口现货 |
询价 | ||
BZD |
22+ |
QFP |
500 |
样品可出,优势库存欢迎实单 |
询价 |