HSMZ-C170中文资料Broadcom HSMZ-C170 High Performance ChipLED数据手册Broadcom规格书

描述 Description

This chip-type LED utilize Aluminum Indium Gallium Phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents. The available color in this surface mount is 631 nm red for TS AlInGaP.This package is binned by intensity.This ChipLED comes in top emitting package with wide viewing angle suitable for light piping and direct backlighting of keypads and panels. In order to facilitate pick and place operation, this ChipLED is shipped in tape and reel, with 4000 units per reelThis package is compatible with IR soldering process

特性 Features

•HighbrightnessAlInGaPmaterial
•Smallsize
•Industrystandardfootprint
•Diffusedoptics
•CompatiblewithIRsoldering
•Availablein8mmtapeon7\"diameterreel
•Reelsealedinziplockedmoisturebarrierbags

应用 Application

LCD backlighting
Push button backlighting
Front panel indicator
Symbol indicator
Microdisplays
Small message panel signage

简介

HSMZ-C170属于光电器件的LED指示-分立。由制造生产的HSMZ-C170LED 指示 - 分立发光二极管是在导电时发光的半导体器件。该系列中的 LED 采用单一或阵列配置，用于印刷电路板上的状态指示。这些 LED 通过封装/外壳、波长、视角、正向电压、额定电流、毫烛光等级、颜色和安装类型进行区分。配置包括共阳极或阴极以及双向。