Surface Mount Flip Chip LEDs

Description The HSMX-H670 and HSMX-H690 introduce a revolutionary concept to the world of LEDs. The internal flip chip construction eliminates the wire bond between the chip and printed circuit board. Consequently as a result of the robust construction, product reliability is greatly improved. T

文件：242.03 Kbytes 页数：8 Pages

HP

安捷伦

Tasmy samospajalne - winylowe, mastyksowe

Własciwosci • Łatwe w uzyciu winylowe tasmy mastyksowe • Samoprzylepne - bez rozciagania • Warstwa mastyczna bardzo lepka, zapewnia doskonała ochrone przed wilgocia • Winylowa warstwa wierzchnia zapewnia dodatkowa ochrone • Nie traca własciwosci w niskich temperaturach • Główna izolacja ele

文件：49.66 Kbytes 页数：1 Pages

HELLERMANNTYTONHellermann Tyton

海尔曼太通海尔曼太通(无锡)电器配件有限公司

EPITAXIAL PLANAR NPN TRANSISTOR (SWITCHING, INTERFACE CIRCUIT AND DRIVER CIRCUIT)

SWITCHING APPLICATION. INTERFACE CIRCUIT AND DRIVER CIRCUIT APPLICATION FEATURES • With Built-in Bias Resistors. • Simplify Circuit Design. • Reduce a Quantity of Parts and Manufacturing Process.

文件：69.21 Kbytes 页数：6 Pages

KECKEC(Korea Electronics)

开益禧无锡开益禧半导体有限公司

EPITAXIAL PLANAR NPN TRANSISTOR (SWITCHING, INTERFACE CIRCUIT AND DRIVER CIRCUIT)

SWITCHING APPLICATION. INTERFACE CIRCUIT AND DRIVER CIRCUIT APPLICATION FEATURES ● With Built-in Bias Resistors. ● Simplify Circuit Design. ● Reduce a Quantity of Parts and Manufacturing Process.

文件：69.72 Kbytes 页数：6 Pages

KECKEC(Korea Electronics)

开益禧无锡开益禧半导体有限公司