HSMS-H670中文资料安捷伦科技数据手册PDF规格书

Description

The HSMX-H670 and HSMX-H690 introduce a revolutionary concept to the world of LEDs. The internal flip chip construction eliminates the wire bond between the chip and printed circuit board. Consequently as a result of the robust construction, product reliability is greatly improved.

The HSMX-H670 and HSMX-H690 are available in four colors. The HSMX-H670 adheres to the industry standard 2.0 x 1.25 mm footprint and is intended for designs where space is limited. The small size, low 1.1 mm profile and wide viewing angle make these LEDs excellent for backlighting applications and front panel illumination. The HSMX-H690 adheres to the 1.6 x 0.8 mm industry standard footprint. The low 0.6 mm profile make this excellent for designs where space is limited.

Both packages are compatible with IR and convective reflow soldering processes.

Features

• Improved Reliability

Through Elimination of Internal Wire Bond

• -40 to 85°C Operating Temperature Range

• Small Size

• Industry Standard Footprint

• Diffused Optics

• Compatible with IR Solder Process

• Four Colors Available

• Available in 8 mm Tape on 7 (178 mm) Diameter Reels

Applications

• Keypad Backlighting

• LCD Backlighting

• Symbol Backlighting

• Front Panel Indicator