HSMD-C170中文资料Surface Mount ChipLED数据手册Broadcom规格书

描述 Description

This chip LED is designed in an industry standard package for ease of handling and use.
The HSMD-C170 has the widely used 2.0 x 1.25 mm footprint.
This package is compatible with IR reflow solder processes. The small size and wide viewing angle makes this LED prime choices for backlighting applications and front panel illumination especially where space is a premium.

特性 Features

•SmallSize
•IndustryStandardFootprint
•CompatiblewithIRSolder
•DiffusedOptics
•OperatingTemperatureRangeof-40°Cto85°C
•Availablein8mmTapeon7in.(178mm)DiameterReels

应用 Application

Keypad Backlighting
Push-Button Backlighting
LCD Backlighting
Symbol Backlighting
Front Panel Indicator

简介

HSMD-C170属于光电器件的LED指示-分立。由制造生产的HSMD-C170LED 指示 - 分立发光二极管是在导电时发光的半导体器件。该系列中的 LED 采用单一或阵列配置，用于印刷电路板上的状态指示。这些 LED 通过封装/外壳、波长、视角、正向电压、额定电流、毫烛光等级、颜色和安装类型进行区分。配置包括共阳极或阴极以及双向。