1U Compute Sled for HTCA-E400

Features • Support 3rd Gen Intel Xeon Scalable Processor (codenamed Ice lake) • Front Access I/O: Storage bays x2, PCIe x1, NIC slot x1, mini-DP port VGA signal), LOM and USB 3.0 ports • Support FHHL PCIe by 16 card • Support OCP NIC 3.0 Modules • Compatible with HTCA-E400 Series

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LANNER

立端科技

Carrier-grade Edge Server Chassis for Open RAN / MEC

Features • Carrier-grade, full redundancy and extreme high performance • 3rd Generation Intel® Xeon® Scalable Processor with AI Acceleration • Support 5x 1U compute sleds or 2x 2U+1U compute sleds • Support 2x 1U switch sleds for redundancy • Support OCP NIC 3.0 Modules, 2U sled Support FH3/4

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LANNER

立端科技

UNIVERSAL INPUT AC-DC MEDICAL APPLICATION OPEN FRAME SINGLE & MULTI-OUTPUT 100 WATTS INTERNAL SWITCHING POWER SUPPLIES

文件：104.89 Kbytes 页数：3 Pages

HITRON

仲琦科技

HMIM100U

文件：394.51 Kbytes 页数：16 Pages

SENSORTECHNICS

Humidity Module

Features • Full temperature compensation over the operating temperature range of -70 °C ... +180 °C (-94 °F ... +356 °F) • High temperature tolerance, also suitable for heat sterilization • Vaisala HUMICAPâ 180R sensor • Easy field calibration by trimmers • Applications: test chambers, i

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VAISALA

维萨拉