首页 >HD3SS3212IRKST>规格书列表

型号下载 订购功能描述制造商 上传企业LOGO

HD3SS3212IRKST

丝印:HD3212I;Package:VQFN;HD3SS3212x Two-Channel Differential 2:1/1:2 USB3.1 Mux/Demux

1 Features 1• Provides MUX/DEMUX Solution for USB Type- C™ Ecosystem for USB 3.1 Gen 1 and Gen 2 Data Rates • Compatible With MIPI DSI/CSI, FPDLinkIII, LVDS, and PCIE Gen II, III • Operates up to 10 Gbps • Wide –3-dB Differential BW of over 8 GHz • Excellent Dynamic Characteristics (at 5 G

文件:1.15531 Mbytes 页数:27 Pages

TI

德州仪器

HD3SS3212IRKST

丝印:HD3212I;Package:VQFN(RKS);HD3SS3212x Two-Channel Differential 2:1/1:2 USB3.1 Mux/Demux

1 Features 1• Provides MUX/DEMUX Solution for USB Type- C™ Ecosystem for USB 3.1 Gen 1 and Gen 2 Data Rates • Compatible With MIPI DSI/CSI, FPDLinkIII, LVDS, and PCIE Gen II, III • Operates up to 10 Gbps • Wide –3-dB Differential BW of over 8 GHz • Excellent Dynamic Characteristics (at 5 G

文件:651.25 Kbytes 页数:27 Pages

TI

德州仪器

HD3SS3212IRKST

Two-Channel Differential 2:1/1:2 USB3.1 Mux/Demux

文件:1.08056 Mbytes 页数:26 Pages

TI

德州仪器

HD3SS3212IRKST

Two-Channel Differential 2:1/1:2 USB3.1 Mux/Demux

文件:1.07281 Mbytes 页数:26 Pages

TI

德州仪器

HD3SS3212IRKST.B

丝印:HD3212I;Package:VQFN;HD3SS3212x Two-Channel Differential 2:1/1:2 USB3.1 Mux/Demux

1 Features 1• Provides MUX/DEMUX Solution for USB Type- C™ Ecosystem for USB 3.1 Gen 1 and Gen 2 Data Rates • Compatible With MIPI DSI/CSI, FPDLinkIII, LVDS, and PCIE Gen II, III • Operates up to 10 Gbps • Wide –3-dB Differential BW of over 8 GHz • Excellent Dynamic Characteristics (at 5 G

文件:1.15531 Mbytes 页数:27 Pages

TI

德州仪器

HD3SS3212IRKST.B

丝印:HD3212I;Package:VQFN(RKS);HD3SS3212x Two-Channel Differential 2:1/1:2 USB3.1 Mux/Demux

1 Features 1• Provides MUX/DEMUX Solution for USB Type- C™ Ecosystem for USB 3.1 Gen 1 and Gen 2 Data Rates • Compatible With MIPI DSI/CSI, FPDLinkIII, LVDS, and PCIE Gen II, III • Operates up to 10 Gbps • Wide –3-dB Differential BW of over 8 GHz • Excellent Dynamic Characteristics (at 5 G

文件:651.25 Kbytes 页数:27 Pages

TI

德州仪器

HD3SS3212IRKST

Package:20-VFQFN 裸露焊盘;包装:管件 类别:集成电路(IC) 模拟开关 - 特殊用途 描述:IC MUX 2:1 8 OHM 20VQFN

TI

德州仪器

产品属性

  • 产品编号:

    HD3SS3212IRKST

  • 制造商:

    Texas Instruments

  • 类别:

    集成电路(IC) > 模拟开关 - 特殊用途

  • 包装:

    管件

  • 应用:

    USB

  • 多路复用器/解复用器电路:

    2:1

  • 开关电路:

    SPDT

  • 导通电阻(最大值):

    8 欧姆

  • 电压 - 电源,单 (V+):

    2.7V ~ 3.6V

  • -3db 带宽:

    8GHz

  • 工作温度:

    -40°C ~ 85°C

  • 安装类型:

    表面贴装型

  • 封装/外壳:

    20-VFQFN 裸露焊盘

  • 供应商器件封装:

    20-VQFN(2.5x4.5)

  • 描述:

    IC MUX 2

供应商型号品牌批号封装库存备注价格
TI
21+
WQFN42
50
全新原装公司现货
询价
TI/德州仪器
22+
VQFN-20
20000
保证原装正品 深圳现货
询价
TI(德州仪器)
24+
VQFN20
7298
原厂可订货,技术支持,直接渠道。可签保供合同
询价
TexasInstruments
24+
SMD
15600
多路复用开关IC
询价
TI/德州仪器
24+
VQFN-20
15050
原厂支持公司优势现货
询价
Texas Instruments
24+
20-VQFN(4.5x2.5)
65200
一级代理/放心采购
询价
TI/德州仪器
23+
20-VQFN
3210
原装正品代理渠道价格优势
询价
TI/德州仪器
QFN
6698
询价
TI
25+
QFN-20
250
就找我吧!--邀您体验愉快问购元件!
询价
TI(德州仪器)
24+/25+
10000
原装正品现货库存价优
询价
更多HD3SS3212IRKST供应商 更新时间2025-12-13 14:02:00