| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
1.0AMP.GlassPassivatedBridgeHighEfficientRectifiers Features ◇ULRecognizedFile#E-96005 ◇Glasspassivatedjunction ◇Idealforprintedcircuitboard ◇Reliablelowcostconstructionutilizingmolded plastictechnique ◇Hightemperaturesolderingguaranteed: 260°C/10seconds/0.375”(9.5mm) leadlengthat5lbs.,(2.3kg | TSCTaiwan Semiconductor Company, Ltd 台湾半导体台湾半导体股份有限公司 | TSC | ||
1.0Ampglasspassivatedbridgehighefficientrectifier50to1000volts Features •HighForwardSurgeCapability •Idealforprintedcircuitboards •HighTemperatureSoldering:250oCfor10seconds •Reliablelowcostconstructionutilizingmoldedplastictechnique | CHENYIShanghai Lunsure Electronic Tech 商朗电子上海商朗电子科技有限公司 | CHENYI | ||
1.0AMP.GlassPassivatedBridgeHighEfficientRectifiers Features ◇Glasspassivatedjunction ◇Idealforprintedcircuitboard ◇Reliablelowcostconstructionutilizingmolded plastictechnique ◇Hightemperaturesolderingguaranteed: 260°C/10seconds/0.375”(9.5mm) leadlengthat5lbs.,(2.3kg)tension ◇Smallsize,simplei | LUGUANGShenzhen Luguang Electronic Technology Co., Ltd 鲁光电子深圳市鲁光电子科技有限公司 | LUGUANG | ||
1.0AMP.GlassPassivatedHighEfficientBridgeRectifiers Features ◇ULRecognizedFile#E-326854 ◇Glasspassivatedjunction ◇Idealforprintedcircuitboard ◇Reliablelowcostconstructionutilizingmoldedplastictechnique ◇Hightemperaturesolderingguaranteed:260℃/10seconds/0.375(9.5mm)leadlengthat5lbs.,(2.3kg)tension ◇Highsu | TSCTaiwan Semiconductor Company, Ltd 台湾半导体台湾半导体股份有限公司 | TSC | ||
SURFACEMOUNTGLASSPASSIVATEDHIGHEFFICIENTBRIDGERECTIFIER Features ●GlassPassivatedDieConstruction ●LowForwardVoltageDrop ●HighCurrentCapability ●HighSurgeCurrentCapability ●DesignedforSurfaceMountApplication ●PlasticMaterial–ULRecognitionFlammabilityClassification94V-O | ZSELECZibo Seno Electronic Engineering Co.,Ltd 淄博圣诺电子淄博圣诺电子工程有限公司 | ZSELEC | ||
1A,50V-1000VGlassPassivatedHighEfficientBridgeRectifiers | TMTTaiwan Memory Technology 凯钰科技凯钰科技股份有限公司 | TMT | ||
1.0AMP.GlassPassivatedHighEfficientBridgeRectifiers | TSCTaiwan Semiconductor Company, Ltd 台湾半导体台湾半导体股份有限公司 | TSC | ||
1A,50V-1000VGlassPassivatedHighEfficientBridgeRectifiers | TMTTaiwan Memory Technology 凯钰科技凯钰科技股份有限公司 | TMT | ||
1.0AMP.GlassPassivatedBridgeHighEfficientRectifiers Features ◇ULRecognizedFile#E-96005 ◇Glasspassivatedjunction ◇Idealforprintedcircuitboard ◇Reliablelowcostconstructionutilizingmolded plastictechnique ◇Hightemperaturesolderingguaranteed: 260°C/10seconds/0.375”(9.5mm) leadlengthat5lbs.,(2.3kg | TSCTaiwan Semiconductor Company, Ltd 台湾半导体台湾半导体股份有限公司 | TSC | ||
1.0AMP.GlassPassivatedBridgeHighEfficientRectifier50to1000Volts Features ·HighForwardSurgeCapability ·Idealforprintedcircuitboards ·HighTemperatureSoldering:250oCfor10seconds ·Reliablelowcostconstructionutilizingmoldedplastictechnique MaximumRatings ·OperatingTemperature:-55°Cto+150°C ·StorageTemperature: | MCCMicro Commercial Components 美微科美微科半导体股份有限公司 | MCC |
详细参数
- 型号：
HCS101
- 功能描述：
编码器、解码器、复用器和解复用器 3.5-13V
- RoHS：
否
- 制造商：
Micrel
- 产品：
Multiplexers
- 逻辑系列：
CMOS
- 线路数量（输入/输出）：
2/12
- 传播延迟时间：
350 ps, 400 ps
- 电源电压-最大：
2.625 V, 3.6 V
- 电源电压-最小：
2.375 V, 3 V
- 最大工作温度：
+ 85 C
- 安装风格：
SMD/SMT
- 封装/箱体：
QFN-44
- 封装：
Tray
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
MICROCHI |
23+ |
SOP |
5500 |
现货,全新原装 |
询价 | ||
MICROCHI |
23+ |
SOP |
9960 |
价格优势/原装现货/客户至上/欢迎广大客户来电查询 |
询价 | ||
MICROCHIP/微芯 |
SOP8 |
6698 |
询价 | ||||
Microchip(微芯) |
23+ |
NA |
20094 |
正纳10年以上分销经验原装进口正品做服务做口碑有支持 |
询价 | ||
MICROCHIP/微芯 |
22+ |
SOP-8 |
100000 |
代理渠道/只做原装/可含税 |
询价 | ||
Microchip(微芯) |
24+ |
NA/ |
8735 |
原厂直销,现货供应,账期支持! |
询价 | ||
MICROCHIP |
2025+ |
SOP8 |
3785 |
全新原厂原装产品、公司现货销售 |
询价 | ||
MICROCHIP |
24+ |
sopdip |
10800 |
询价 | |||
MicrochipTechnology |
24+ |
原厂原装 |
6000 |
进口原装正品假一赔十,货期7-10天 |
询价 | ||
MICROCHIP |
17+ |
6200 |
100%原装正品现货 |
询价 |
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