HCPL-0452中文资料安捷伦科技数据手册PDF规格书

Description

These small outline high CMR, high speed, diode-transistor optocouplers are single channel devices in a five lead miniature footprint. They are electrically equivalent to the following Agilent optocouplers:

The SO-5 JEDEC registered (MO-155) package outline does not require “through holes” in a PCB. This package occupies approximately one-fourth the footprint area of the standard dual-in-line package. The lead profile is designed to be compatible with standard surface mount processes.

Features

• Surface Mountable

• Very Small, Low Profile JEDEC Registered Package Outline

• Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes

• Very High Common Mode Transient Immunity: 15000 V/µs at VCM = 1500 V Guaranteed (HCPL-M453)

• High Speed: 1 Mb/s

• TTL Compatible

• Guaranteed AC and DC Performance over Temperature: 0°C to 70°C

• Open Collector Output

• Recognized Under the Component Program of U.L. (File No. E55361) for Dielectric Withstand Proof Test Voltage of 3750 Vac, 1 Minute

• Lead Free Option

Applications

• Line Receivers - High common mode transient immunity (>1000 V/µs) and low input-output capacitance (0.6 pF).

• High Speed Logic Ground Isolation - TTL/TTL, TTL/LTTL, TTL/CMOS, TTL/LSTTL.

• Replace Slow Phototransistor Optocouplers

• Replace Pulse Transformers - Save board space and weight

• Analog Signal Ground Isolation - Integrated photon detector provides improved linearity over phototransistor type.