HBS602中文资料桑德斯微电子数据手册PDF规格书

特性 Features

• Surface mount bridge, small package;

• Ideal for printed circuit boards;

• Glass passivated chip junction;

• High surge current capability;

• High heat dissipation capability;

• Low profile package;

• Low forward voltage drop;

• Plastic package has Underwrites Laboratory

Flammability Classification 94V-0

• This is a Pb − Free Device

• All SMC parts are traceable to the wafer lot

• Additional testing can be offered upon request