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H5AN4G8NBJR-XXI中文资料PDF规格书
H5AN4G8NBJR-XXI规格书详情
FEATURES
• VDD=VDDQ=1.2V +/- 0.06V
• Fully differential clock inputs (CK, CK) operation
• Differential Data Strobe (DQS, DQS)
• On chip DLL align DQ, DQS and DQS transition with CK
transition
• DM masks write data-in at the both rising and falling
edges of the data strobe
• All addresses and control inputs except data, data
strobes and data masks latched on the rising edges of
the clock
• Programmable CAS latency 9, 11, 12, 13, 14, 15, 16,
17, 18, 19 and 20
• Programmable additive latency 0, CL-1, and CL-2
supported (x4/x8 only)
• Programmable CAS Write latency (CWL) = 9, 10, 11,
12, 14, 16, 18
• Programmable burst length 4/8 with both nibble
sequential and interleave mode
• BL switch on the fly
• 16banks
• Average Refresh Cycle (Tcase of 0 oC~ 95 oC)
- 7.8 μs at 0oC ~ 85 oC
- 3.9 μs at 85oC ~ 95 oC
• Operating Temperture Range
- Commercial Temperature (0 oC~ 95 oC)
- Industrial Temperature (-40oC~ 95 oC)
• JEDEC standard 78ball FBGA(x4/x8), 96ball FBGA(x16)
• Driver strength selected by MRS
• Dynamic On Die Termination supported
• Two Termination States such as RTT_PARK and
RTT_NOM switchable by ODT pin
• Asynchronous RESET pin supported
• ZQ calibration supported
• TDQS (Termination Data Strobe) supported (x8 only)
• Write Levelization supported
• 8 bit pre-fetch
• This product in compliance with the RoHS directive.
• Internal Vref DQ level generation is available
• Write CRC is supported at all speed grades
• Maximum Power Saving Mode is supported
• TCAR(Temperature Controlled Auto Refresh) mode is
supported
• LP ASR(Low Power Auto Self Refresh) mode is supported
• Fine Granularity Refresh is supported
• Per DRAM Addressability is supported
• Geardown Mode(1/2 rate, 1/4 rate) is supported
• Programable Preamble for read and write is supported
• Self Refresh Abort is supported
• CA parity (Command/Address Parity) mode is supported
• Bank Grouping is applied, and CAS to CAS latency
(tCCD_L, tCCD_S) for the banks in the same or different
bank group accesses are available
• DBI(Data Bus Inversion) is supported(x8/x16)
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
SKHYNIX |
19+ |
BGA |
30000 |
进口原装现货 |
询价 | ||
SKHYNIX |
24+ |
ROHS |
990000 |
明嘉莱只做原装正品现货 |
询价 | ||
SKHYNIX |
23+ |
BGA |
90000 |
只做原厂渠道价格优势可提供技术支持 |
询价 | ||
SKHYNIX |
2021+ |
BGA |
100500 |
一级代理专营品牌!原装正品,优势现货,长期排单到货 |
询价 | ||
SKHYNIX |
22+ |
BGA |
12000 |
只做原装、原厂优势渠道、假一赔十 |
询价 | ||
SKHYNIX |
23+ |
BGA |
12700 |
优势原装现货假一赔十 |
询价 | ||
SKHYNIX |
19+ |
BGA |
3200 |
专注原装正品内存芯片闪存芯片另高价回收库 |
询价 | ||
收购此料 |
2023+ |
FBGA |
80000 |
一级代理/分销渠道价格优势 十年芯程一路只做原装正品 |
询价 | ||
SKHYNIX |
23+ |
BGA |
20000 |
不忘初芯-只做原装正品 |
询价 | ||
SKHYNIX |
22+ |
FBGA |
3000 |
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、 |
询价 |