H2BF中文资料RFE国际公司数据手册PDF规格书
H2BF规格书详情
Features
Low profile package
Ideal for automated placement
Glass passivated chip junction
High forward surge capability
Super fast reverse recovery time
Meets MSL level 1, per J-STD-020, LF maximum peak
of 260 °C
Features
Low profile package
Ideal for automated placement
Glass passivated chip junction
High forward surge capability
Super fast reverse recovery time
Meets MSL level 1, per J-STD-020, LF maximum peak
of 260 °C
