GRM155C80J475MEAAD电容器的陶瓷电容器规格书PDF中文资料

2. Application

SSD (Solid State Drive), portable devices, etc.

3. Features

 Power supply voltage (VIN): 2.9 V to 5.5 V

(PVIN1 to 6): 2.9 V to 5.5 V

(LDO1_IN): 2.9 V to 5.5 V

 IC operation condition setting when the power supply voltage is set to 3.3 V/5.0 V by MODE_SEL pin.

 6 CH DC-DC convertor + 2 CH LDO

･ CH1: 2.325 V to 2.700 V (25 mV step), 4.0 A (MAX)

･CH2: 1.175 V to 1.550 V / 1.025 V to 1.400 V (25 mV step), 1.0 A (MAX)

･CH3: 1.625 V to 2.000 V (25 mV step), 2.0 A(MAX)

･ CH4: 0.825 V to 1.200 V / 1.625 V to 2.000 V (25 mV step), 1.0 A (MAX)

･ CH5: 0.825 V to 1.200 V / 0.725 V to 1.100 V (25 mV step), 1.0 A (MAX)

･ CH6: 0.825 V to 1.200 V / 0.725 V to 1.100 V (25 mV step), 3.5 A (MAX)

･ LDO1: 2.325 V to 2.700 V / 1.625 V to 2.000 V (25 mV step), 0.3 A (MAX)

･ LDO2: 3.125 V to 3.500 V (25 mV step), 0.3 A (MAX)

 Built-in BYPASS-SW: CH1, LDO2

 Built-in LOAD-SW: CH5

 Efficiency control in the case of the light load (PWM/PFM operation)

 Control by I2C interface

 Initial values selection of DC-DC (CH1 to CH6) and LDO1 output by VSEL0 pin

 Built-in input PROTECTION-SW

 Built-in protection functions

･Low input voltage detection circuit (UVLO)

･Input power supply Over Voltage Protection (OVP_1)

･Input power supply Over Current Limitation (OCL_1)

･Input power supply Over Current Protection (OCP)

･Output Over Voltage Protection (OVP_2)

･Output Under Voltage Protection (UVP)

･Output Over Current Limitation (OCL_2)

･Thermal Shutdown protection (TSD)

 Package: S-UFBGA45-0403-0.40-001 (2.91 mm ×3.31 mm, 0.4 mm Pitch)