GPY0130A中文资料Monolithic and Wafer Level Packaged Three-Axis Accelerometer数据手册Generalplus规格书

描述 Description

The Three-Axis Thermal Accelerometer is based on Proprietary thermal technology that is built with 0.18µm standard CMOS process and the most advanced Wafer Level Packaging. This device contains no moving sensor parts and thus eliminates field reliability and repeatability issues associated with competitive products. For example, there is no measurable resonance (immunity to vibration), no stiction, and no detectable hysteresis. It also eliminates the \"click\" sounds typically heard in ball based orientation sensors. Shock survival of the MEMS sensing structure is greater than 200,000g. This sensor provides X/Y/Z axis acceleration signals with very low 0g offset, and temperature signal with high accuracy. In addition, it detects six orientation positions, X/Y shake and shake directions.

特性 Features

• Most Advantaged Technology in Industry
• Monolithically-Integrated Single Chip MEMS Sensor with On-Chip Signal Processing
• >200,000g Shock Survival Rating of Sensing Structure
• 12-bit Signal Output for X, Y and Z Axes
• Full Scale Range ±2g, ±4g and ±8g
• 8-bit Temperature Output (-50°C to +100°C)
• Smallest Wafer Level Package (WLP) Footprint 1.18mm×1.70mm×0.85mm
• 6-Position Orientation Detection
• Shake Detection with Interrupt
• Programmable Shake Detection Threshold
• I2C Slave, FAST (≤400 KHz) Mode Interface
• 1.8~3.6V Single Supply Continuous Operation
• 1.8V Compatible I/O
• Embedded Power Up/Down Mode
• Eight I2C Addresses Pre-settable by User
• RoHS Compliant