GPP20A_V01中文资料威世数据手册PDF规格书

FEATURES

• Glass passivated chip junction

• Low forward voltage drop

• Low leakage current, typical IR less than 0.1 μA

• High forward surge capability

• Meets environmental standard MIL-S-19500

• Solder dip 275 °C max. 10 s, per JESD 22-B106

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

TYPICAL APPLICATIONS

For use in general purpose rectification of power supplies,

inverters, converters and freewheeling diodes application.

MECHANICAL DATA

Case: DO-15 (DO-204AC), molded epoxy over passivated

chip

Molding compound meets UL 94 V-0 flammability rating

Base P/N-E3 - RoHS-compliant, commercial grade

Terminals: matte tin plated leads, solderable per

J-STD-002 and JESD 22-B102

E3 suffix meets JESD 201 class 1A whisker test

Polarity: color band denotes cathode end