GC1304数据手册Microchip中文资料规格书

描述 Description

Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high performance wireless applications.  Select varactors from three families of C/V curves for designs through 6 GHz.  They are available in multiple chip configuration as well as outlines which directly replace SOT23 and SOT323 devices. Other devices and values are always available.  Contact our applications engineering department for more details.