丝印：GBPC1501；Package：GBPC4L；Bridge Rectifiers (Glass Passivated)

Features • Integrally Molded Heat−Sink Provided Very Low Thermal Resistance for Maximum Heat Dissipation • Surge Overload Ratings from 300 A to 400 A • Isolated Voltage from Case to Lead over 2500 V • UL Certified, UL #E258596 • Terminals Finish Material ♦ Silver (Solderable per MIL−STD−202

文件：329.32 Kbytes 页数：7 Pages

ONSEMI

安森美半导体

丝印：GBPC1501；Package：GBPC；Bridge Rectifiers

Features Universal 3-way terminals: snap-on, wire wrap-around, or PCB mounting High surge current capability Low thermal resistance Solder dip 275 °C max. 7 s, per JESD 22-B106

文件：2.5918 Mbytes 页数：3 Pages

RFE

RFE international

丝印：GBPC1501；Package：GBPC-4L；Bridge Rectifiers (Glass Passivated)

Features  Integrally Molded Heat−Sink Provided Very Low Thermal Resistance for Maximum Heat Dissipation  Surge Overload Ratings from 300 A to 400 A  Isolated Voltage from Case to Lead over 2500 V  UL Certified, UL #E258596  Terminals Finish Material  Silver (Solderable per MIL−STD−202

文件：244.58 Kbytes 页数：8 Pages

ONSEMI

安森美半导体

丝印：GBPC1501W；Package：GBPC-W4L；Bridge Rectifiers (Glass Passivated)

Features • Integrally Molded Heat−Sink Provided Very Low Thermal Resistance for Maximum Heat Dissipation • Surge Overload Ratings from 300 A to 400 A • Isolated Voltage from Case to Lead over 2500 V • UL Certified, UL #E258596 • Terminals Finish Material ♦ Silver (Solderable per MIL−STD−202

文件：329.32 Kbytes 页数：7 Pages

ONSEMI

安森美半导体

丝印：GBPC1501W；Package：GBPC-W-4L；Bridge Rectifiers (Glass Passivated)

Features  Integrally Molded Heat−Sink Provided Very Low Thermal Resistance for Maximum Heat Dissipation  Surge Overload Ratings from 300 A to 400 A  Isolated Voltage from Case to Lead over 2500 V  UL Certified, UL #E258596  Terminals Finish Material  Silver (Solderable per MIL−STD−202

文件：244.58 Kbytes 页数：8 Pages

ONSEMI

安森美半导体

丝印：GBPC1501；Package：GBPC-4L；Bridge Rectifiers (Glass Passivated)

Features  Integrally Molded Heat−Sink Provided Very Low Thermal Resistance for Maximum Heat Dissipation  Surge Overload Ratings from 300 A to 400 A  Isolated Voltage from Case to Lead over 2500 V  UL Certified, UL #E258596  Terminals Finish Material  Silver (Solderable per MIL−STD−202

文件：244.58 Kbytes 页数：8 Pages

ONSEMI

安森美半导体

丝印：GBPC1501；Package：GBPC4L；Bridge Rectifiers (Glass Passivated)

Features • Integrally Molded Heat−Sink Provided Very Low Thermal Resistance for Maximum Heat Dissipation • Surge Overload Ratings from 300 A to 400 A • Isolated Voltage from Case to Lead over 2500 V • UL Certified, UL #E258596 • Terminals Finish Material ♦ Silver (Solderable per MIL−STD−202

文件：329.32 Kbytes 页数：7 Pages

ONSEMI

安森美半导体

丝印：GBPC1501；Package：GBPC；Bridge Rectifiers

Features Universal 3-way terminals: snap-on, wire wrap-around, or PCB mounting High surge current capability Low thermal resistance Solder dip 275 °C max. 7 s, per JESD 22-B106

文件：2.5918 Mbytes 页数：3 Pages

RFE

RFE international

丝印：GBPC1501W；Package：GBPC-W-4L；Bridge Rectifiers (Glass Passivated)

Features  Integrally Molded Heat−Sink Provided Very Low Thermal Resistance for Maximum Heat Dissipation  Surge Overload Ratings from 300 A to 400 A  Isolated Voltage from Case to Lead over 2500 V  UL Certified, UL #E258596  Terminals Finish Material  Silver (Solderable per MIL−STD−202

文件：244.58 Kbytes 页数：8 Pages

ONSEMI

安森美半导体

丝印：GBPC1501W；Package：GBPC-W4L；Bridge Rectifiers (Glass Passivated)

Features • Integrally Molded Heat−Sink Provided Very Low Thermal Resistance for Maximum Heat Dissipation • Surge Overload Ratings from 300 A to 400 A • Isolated Voltage from Case to Lead over 2500 V • UL Certified, UL #E258596 • Terminals Finish Material ♦ Silver (Solderable per MIL−STD−202

文件：329.32 Kbytes 页数：7 Pages

ONSEMI

安森美半导体