丝印：GBL；Package：SSOP6-P-0.65A；Dual Schmitt Buffer

Features • High output current : ±8 mA (min) at VCC = 3 V • Super high speed operation : tpd = 3.7 ns (typ.) at VCC = 3.3 V, 15pF • Operating voltage range :VCC = 0.9 to 3.6 V • 5.5-V tolerant inputs • 3.6-V power down protection outputs

文件：149.1 Kbytes 页数：6 Pages

TOSHIBA

东芝

丝印：GBL；Package：16Ld2.6x1.8UTQFN；Dual, 128-Tap, Low Voltage Digitally Controlled Potentiometer (XDCP??

文件：1.0807 Mbytes 页数：20 Pages

RENESAS

瑞萨

丝印：GBL；Package：16Ld2.6x1.8UTQFN；Dual, 128-Tap, Low Voltage Digitally Controlled Potentiometer (XDCP??

文件：1.0807 Mbytes 页数：20 Pages

RENESAS

瑞萨

丝印：GBLN3303；Package：SOP-8；MOSFET

Features - Good stability and uniformity. - AEC-Q101 Qualified. - Lower RDS(on).

文件：665.01 Kbytes 页数：7 Pages

COMCHIP

典琦

丝印：GBLN6601；Package：PDFN5x6-8LC；MOSFET

Features - Super low gate charge. - Excellent Cdv/dt effect decline. - Advanced high cell density trench technology. - AEC-Q101 Qualified.

文件：545.53 Kbytes 页数：6 Pages

COMCHIP

典琦

丝印：GBL2005；Package：2KBJ；Bridge Rectifiers

Features UL recognition, file #£230084 Glass passivated chip junction Thin single in-line package High surge current capability Solder dip 275 °C max. 7 s, per JESD 22-B106

文件：2.5918 Mbytes 页数：3 Pages

RFE

RFE international

丝印：GBL2005；Package：GBL；Bridge Rectifiers

Features - High efficiency. - Idea for automated placement. - High surge current capability.

文件：505.73 Kbytes 页数：3 Pages

COMCHIP

典琦

丝印：GBL201；Package：2KBJ；Bridge Rectifiers

Features UL recognition, file #£230084 Glass passivated chip junction Thin single in-line package High surge current capability Solder dip 275 °C max. 7 s, per JESD 22-B106

文件：2.5918 Mbytes 页数：3 Pages

RFE

RFE international

丝印：GBL201；Package：GBL；Bridge Rectifiers

Features - High efficiency. - Idea for automated placement. - High surge current capability.

文件：505.73 Kbytes 页数：3 Pages

COMCHIP

典琦

丝印：GBL202；Package：2KBJ；Bridge Rectifiers

Features UL recognition, file #£230084 Glass passivated chip junction Thin single in-line package High surge current capability Solder dip 275 °C max. 7 s, per JESD 22-B106

文件：2.5918 Mbytes 页数：3 Pages

RFE

RFE international