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FS770R08A6P2B分立半导体产品晶体管-IGBT-模块规格书PDF中文资料
厂商型号 |
FS770R08A6P2B |
参数属性 | FS770R08A6P2B 封装/外壳为模块;包装为托盘;类别为分立半导体产品 > 晶体管 - IGBT - 模块;产品描述:HYBRID PACK DRIVE |
功能描述 | HybridPACK™ Drive Module |
文件大小 |
1.83146 Mbytes |
页面数量 |
16 页 |
生产厂商 | Infineon Technologies AG |
企业简称 |
Infineon【英飞凌】 |
中文名称 | 英飞凌科技股份公司官网 |
原厂标识 | |
数据手册 | |
更新时间 | 2024-9-26 13:30:00 |
FS770R08A6P2B规格书详情
Electrical Features
•Blocking voltage 750V
•Low VCEsat
•Low Switching Losses
•Low Qg and Crss
•Low Inductive Design
•Tvj op = 150°C
•Short-time extended Operation Temperature
Tvj op = 175°C
Mechanical Features
•4.2kV DC 1sec Insulation
•High Creepage and Clearance Distances
•Compact design
•High Power Density
•Direct Cooled Base Plate with Ribbon Bonds
•Guiding elements for PCB and cooler assembly
•Integrated NTC temperature sensor
•PressFIT Contact Technology
•RoHS compliant
•UL 94 V0 module frame
Description
The HybridPACKTM Drive is a very compact
six-pack module optimized for hybrid and electric
vehicles. The product FS770R08A6P2FB comes
with a flat baseplate and bonded cooling structure
and is a 750V/770A module derivate within the
HybridPACK Drive family. The power module
implements the new EDT2 IGBT generation, which
is an automotive Micro-Pattern Trench-Field-Stop
cell design optimized for electric drive train
applications. The chipset has benchmark current
density combined with short circuit ruggedness and
increased blocking voltage for reliable inverter
operation under harsh environmental conditions.
The EDT2 IGBTs also show excellent light load
power losses, which helps to improve system
efficiency over a real driving cycle. The EDT2 IGBT
was optimized for applications with switching
frequencies in the range of 10 kHz.
The new HybridPACKTM Drive power module family
comes with mechanical guiding elements
supporting easy assembly processes for customers.
Furthermore, the press-fit pins for the signal
terminals avoid additional time consuming selective
solder processes, which provides cost savings on
system level and increases system reliability. The
products in the HybridPACK Drive family with flat
baseplate FS660R08A6P2FB; PinFin baseplate
FS820R08A6P2B as well as the FS770R08A6P2B
derivate allow a very cost effective scaling for
different inverter power levels at a minimum inverter
design effort.
FS770R08A6P2B属于分立半导体产品 > 晶体管 - IGBT - 模块。英飞凌科技股份公司制造生产的FS770R08A6P2B晶体管 - IGBT - 模块绝缘栅双极晶体管 (IGBT) 是三端功率半导体器件,主要用作电子开关,兼具高效率和快速切换优点。作为模块,IGBT 配置为非对称式桥; 升压、降压和制动斩波器;全桥、三电平和三相逆变器。有些器件内置了用于监控温度的 NTC 热敏电阻。IGBT 模块可根据最大功率、集电极电流、集射击穿电压和配置进行区分。
产品属性
更多- 产品编号:
FS770R08A6P2BBPSA1
- 制造商:
Infineon Technologies
- 类别:
分立半导体产品 > 晶体管 - IGBT - 模块
- 系列:
HybridPACK™
- 包装:
托盘
- IGBT 类型:
沟槽型场截止
- 配置:
三相反相器
- 不同 Vge、Ic 时 Vce(on)(最大值):
1.35V @ 15V,450A
- 输入:
标准
- NTC 热敏电阻:
是
- 工作温度:
-40°C ~ 150°C(TJ)
- 安装类型:
底座安装
- 封装/外壳:
模块
- 供应商器件封装:
AG-HYBRIDD-1
- 描述:
HYBRID PACK DRIVE
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
Infineon |
2405+ |
原厂封装 |
5000 |
15年芯片行业经验/只供原装正品:0755-83273626邹小姐 |
询价 | ||
IMI |
2023+ |
SOP8 |
80000 |
一级代理/分销渠道价格优势 十年芯程一路只做原装正品 |
询价 | ||
FUET(福声科技) |
21+ |
引线 |
46800 |
中国航天工业部战略合作伙伴行业领导者 |
询价 | ||
Infineon |
23+ |
标准封装 |
5000 |
原厂授权一级代理 IGBT模块 可控硅 晶闸管 熔断器质保 |
询价 | ||
IMI |
1803+ |
SOP |
5316 |
向鸿原装现货库存,代理渠道可原厂发货-优势 |
询价 | ||
IMI |
23+ |
SOP8散新 |
2766 |
询价 | |||
Infineon Technologies |
23+ |
原装 |
5000 |
原装正品,提供BOM配单服务 |
询价 | ||
IMI |
2020+ |
SOP8 |
16800 |
绝对原装进口现货,假一赔十,价格优势!? |
询价 | ||
IMI |
1948+ |
SOP8 |
6852 |
只做原装正品现货!或订货假一赔十! |
询价 | ||
Infineon(英飞凌) |
23+ |
6000 |
诚信服务,绝对原装原盘 |
询价 |